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Multi-silicon-wafer transporting, taking and delivering vehicle

A silicon wafer and car body technology, applied in the field of multi-silicon wafer transport pick-up and delivery vehicles, can solve the problems of unavailable machine pick-up and delivery, low production efficiency, high-temperature burns of staff, etc., and achieves simple structure, high work efficiency, and improved The effect of pickup efficiency

Active Publication Date: 2021-07-20
PIOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the present invention provides a multi-silicon wafer transportation pickup and delivery vehicle to solve the problem that the previous silicon wafer transportation vehicle can only realize the transportation of silicon wafers and trays, but cannot realize the function of picking up and delivering on the machine, resulting in low production efficiency , prone to the problem of high temperature burns for staff

Method used

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  • Multi-silicon-wafer transporting, taking and delivering vehicle
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  • Multi-silicon-wafer transporting, taking and delivering vehicle

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Embodiment Construction

[0055]Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present invention. Rather, they are merely examples of means consistent with aspects of the invention as recited in the appended claims.

[0056] Since the previous silicon wafer transport vehicle can only realize the transportation of silicon wafers and trays, it cannot realize the pick-up and delivery of silicon wafers on the machine, and the pick-up and delivery of silicon wafers need to be done manually, resulting in low production efficiency and prone to accidents The problem of high temperature burns for personnel. Therefore, this embodiment p...

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Abstract

The invention discloses a multi-silicon-wafer transporting, taking and delivering vehicle which has the functions of lifting and stretching besides the conventional wafer transporting function, a first lifting mechanism is designed in a bearing, taking and delivering mechanism, the first lifting mechanism can drive a tray taking and delivering mechanism and a tray to ascend and descend, meanwhile, a telescopic guide rail is designed in the bearing, taking and delivering mechanism, and the telescopic guide rail can drive the tray taking and delivering mechanism and the tray to ascend and descend. Furthermore a telescopic guide rail is designed in the bearing, taking and delivering mechanism, furthermore frontward and backward telescoping of a tray bearing plate can be realized, and a tray is driven to perform frontward and backward telescoping. The taking and sending function of the transportation taking and sending vehicle can be completed through cooperation of the telescopic function and the lifting function, manual taking and sending are replaced, the transportation taking and sending vehicle can take and send a large number of silicon wafers at a time on the basis of transportation, the silicon wafer tray taking and sending efficiency is improved, the problem that high-temperature scalding is easily caused when the silicon wafers are manually taken and conveyed in the past is effectively solved; the transporting, taking and delivering vehicle has the advantages of being simple in structure, reasonable in design, convenient to use, capable of achieving one-time taking and delivering of a large number of silicon wafers, high in working efficiency, good in safety and the like.

Description

technical field [0001] The disclosure of the invention relates to the technical field of silicon wafer transport equipment, in particular to a multi-silicon wafer transport pick-up vehicle. Background technique [0002] At present, the silicon wafer transportation vehicle is only used for the transportation of silicon wafers and trays. Every time the silicon wafers and trays are transported to the machine by the transport vehicle, it is necessary to manually place the silicon wafers and trays into the reaction chamber of the machine for heating. on a plate for processing. After the process is completed, it is necessary to manually remove the silicon wafer or the tray carrying the silicon wafer from the heating plate of the reaction chamber. [0003] The above method is okay for a small amount of silicon wafer processing, but for the case of multiple silicon wafers, it is not only time-consuming and laborious, but also has the risk of high temperature burns for the staff who...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B62B3/02B62B5/00
CPCB62B3/02B62B5/00
Inventor 吴凤丽王燚刘闻敏刘振张亚新
Owner PIOTECH CO LTD
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