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Solder mask cavity defect treatment method

A defect treatment and void technology, which is applied in the field of PCB board welding, can solve problems such as PCB board void defects, and achieve the effect of solving void defects

Inactive Publication Date: 2021-08-03
芜湖顶贴电子有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiency of solder joint void defects caused by moisture absorption and moisture in the prior art PCB board welding, the present invention provides a processing method for preventing solder joint void defects, which solves the problem of void defects caused by moisture absorption and moisture absorption when PCB boards are stored

Method used

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  • Solder mask cavity defect treatment method

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Embodiment Construction

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0032] Such as Figure 1-3 As shown, the present invention provides a technical solution: a method for treating void defects in solder joints, comprising the following steps:

[0033] S1. Make a sealable packaging bag corresponding to the model of the PCB board. The top opening of the packaging bag is convenient to put into the PCB board, and the surrounding edges are sealed;

[0034] S2, making a humidity display card;

[0035] S3, put the PCB board and the...

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Abstract

The invention discloses a solder mask cavity defect treatment method, and relates to the technical field of PCB welding. The solder mask cavity defect treatment method comprises the following steps: S1, manufacturing a sealable packaging bag corresponding to the model of a PCB, S2, manufacturing a humidity display card, S3, putting the PCB and the humidity display card into the packaging bag for sealing processing, S4, vacuumizing the sealed packaging bag, S5, regularly observing humidity display cards in the packaging bag with the PCB one by one and detecting the air tightness of the packaging bag, and S6, regularly weighing the packaging bag with the PCB, and judging the absorbed moisture. The packaging bag is composed of the bag body and a one-way air valve, the PCBs are independently packaged, the PCBs to be used are regularly detected through the humidity display card and the weighing method, baking treatment and regular use are carried out, it can be guaranteed that the PCBs used in the welding technology are not subjected to moisture absorption and damp, and the problem that when the PCBs are stored, the PCBs are subjected to moisture absorption and damp, and consequently the cavity defect is caused is solved.

Description

technical field [0001] The invention relates to the technical field of PCB board welding, in particular to a processing method for preventing void defects in solder joints. Background technique [0002] With the development of electronic technology, users' requirements for electronic products have also been further improved. The process requirements of PCB solder joints: the mechanical strength of the solder joints must be sufficient; the welding is reliable and the electrical conductivity is guaranteed; the surface of the solder joints must be smooth and clean. When the board is soldered, it will inevitably produce voids; air conditioning means that small holes appear on the solder joints, and the inside of the small holes is hollow, usually with pinholes and blow holes. The impact of voids on PCB board solder joints will be reduced. The mechanical strength of solder joints affects the reliability and life of solder joints. The smaller the void area, the better. A small amo...

Claims

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Application Information

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IPC IPC(8): B65D33/16B65D30/24B65D85/90G01N5/02G01N33/00
CPCB65D33/16B65D31/14G01N5/025G01N33/00
Inventor 田礼芳黄春琼
Owner 芜湖顶贴电子有限公司
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