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Wafer test dislocation monitoring method, device, equipment and storage medium

A technology of wafer testing and monitoring devices, applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc.

Active Publication Date: 2021-12-28
深圳米飞泰克科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The embodiment of the present application provides a method, device, equipment and storage medium for monitoring wafer test dislocation, which can solve the problem of how to monitor whether wafer test dislocation occurs

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  • Wafer test dislocation monitoring method, device, equipment and storage medium
  • Wafer test dislocation monitoring method, device, equipment and storage medium
  • Wafer test dislocation monitoring method, device, equipment and storage medium

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Embodiment Construction

[0062] In order to make the purpose, technical solution and advantages of the present application clearer, the implementation manners of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0063] It should be understood that the "plurality" mentioned in this application means two or more. In the description of this application, unless otherwise specified, " / " means or means, for example, A / B can mean A or B; "and / or" in this article is just a description of the relationship between associated objects, Indicates that there may be three relationships, for example, A and / or B, may indicate: A exists alone, A and B exist simultaneously, and B exists alone. In addition, in order to clearly describe the technical solution of the present application, words such as "first" and "second" are used to distinguish the same or similar items with basically the same function and effect. Those skilled in the art can understand tha...

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Abstract

The application discloses a monitoring method, device, equipment and storage medium for wafer test dislocation, belonging to the technical field of semiconductors. The method includes: acquiring test results of chips at multiple specified positions in the first wafer, and obtaining test results of multiple chips, the test results are used to indicate that the corresponding chips are valid or invalid; according to the test results of the multiple chips , determine the failed chip information, the failed chip information includes the failed chip ratio of the failed chips among the plurality of chips and / or the location distribution information of the failed chips; according to the failed chip information, determine whether the first wafer has a test dislocation. The present application solves the problem of how to monitor whether the test dislocation occurs on the wafer, so as to avoid the situation that bad chips are wrongly packaged and good chips are discarded due to the test dislocation.

Description

technical field [0001] The present application relates to the technical field of semiconductors, in particular to a method, device, equipment and storage medium for monitoring dislocation of a wafer test. Background technique [0002] Wafer refers to the silicon wafer used in the manufacture of silicon semiconductor integrated circuits, which is circular in shape. The wafer includes multiple chips. After the wafer is mass-produced, various electrical parameter tests and functional tests are usually performed on each chip on the wafer, and then the test results and coordinate information of the tested chips are stored in the In the file, so that the subsequent packaging factory can package the valid chips on the wafer according to the file, and reject the invalid chips and not package them. [0003] Usually, for the same type of wafer, the chip whose coordinate origin is fixed during testing. However, due to the abnormality of the test equipment or the operator's misoperati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67259
Inventor 王英广肖绪峰王健刘超
Owner 深圳米飞泰克科技股份有限公司