Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

FPC board turnover device and board turnover method

A flap and panel technology, applied in the direction of transportation and packaging, conveyors, conveyor objects, etc., can solve the problems of flap, unfavorable FPC bonding efficiency, no stable and reliable products or structures, etc., and achieve a simple and compact overall structure Effect

Active Publication Date: 2021-08-24
SHENZHEN XINZHONGDA AUTOMATION TECH
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the advancement of the FPC lamination process, this automatic lamination production line with jig plates is not conducive to the improvement of FPC lamination efficiency. However, due to the soft nature of FPC, there has been no stable and reliable product or structure to replace
[0003]Therefore, it is necessary to design a stable and reliable FPC turning machine without fixture board to solve the problem of automatic laminating line of FPC without fixture board. flap problem

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • FPC board turnover device and board turnover method
  • FPC board turnover device and board turnover method
  • FPC board turnover device and board turnover method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0028] In the present invention, in the case of no contrary description, the used orientation words such as "up, down, left, right, front, back" usually refer to the upper, lower, left, right, front, back in the drawings. , "inner and outer" refers to the inner and outer relative to the outline of the part.

[0029] It should be noted that the terms "first" and "second" in the claims, description and drawings of the present application are used to distinguish similar objects, but not necessarily used to describe a specific sequence or sequence. It should be understood that the data so used may be interchanged where appropriate for implementation in sequences ot...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an FPC board turnover device and a board turnover method. The FPC board turnover device comprises a base, a rotary driving assembly, an opening and closing driving assembly and a board turnover assembly, wherein the rotary driving assembly, the opening and closing driving assembly and the board turnover assembly are fixed on the base; the base comprises a machine frame, a panel which is fixed on the machine frame and is horizontally arranged, and a vertical column plate which is fixed on the panel and is vertically arranged; the rotary driving assembly is fixed to the vertical column plate and drives the board turnover assembly to rotate in the vertical direction; and the opening and closing driving assembly is fixed to the panel and located below the board turnover assembly and drives the board turnover assembly to conduct linear opening and closing movement in the vertical direction. An FPC is clamped through the board turnover assembly, automatic board turnover of the FPC is realized under the cooperation of the rotary driving assembly and the opening and closing driving assembly, the overall structure is simple and compact, and a jig plate is not needed.

Description

technical field [0001] The invention relates to the technical field of automatic bonding of materials for electronic circuit boards, in particular to an FPC flipping device and a flipping method. Background technique [0002] In the production of FPC (Flexible Printed Circuit, flexible circuit board), it is often necessary to mount components, reinforcement, cover film and adhesive tape on both sides of the FPC flexible circuit board. From the front side operation to the reverse side operation of FPC, the flippers on the market generally turn over with the jig board. At this stage, the automatic lamination production line uses the jig board to place the FPC flexible circuit board. However, with the advancement of the FPC lamination process, this automatic lamination production line with jig plates is not conducive to the improvement of FPC lamination efficiency. However, due to the soft nature of FPC, there has been no stable and reliable product or structure to replace . ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/248
CPCB65G47/248B65G2201/022
Inventor 胡大治夏士坤杨少辉
Owner SHENZHEN XINZHONGDA AUTOMATION TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com