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Integrated circuit device with stacked dies having mirrored circuitry

A technology of integrated circuits and grains, applied in the direction of electric solid devices, circuits, electrical components, etc.

Pending Publication Date: 2021-08-24
XILINX INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While stacking IC dies is desirable for enhanced memory or processing capabilities, during the manufacture of stacked integrated circuit devices, stacking IC dies presents additional manufacturing complexity, challenges, and thus costs

Method used

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  • Integrated circuit device with stacked dies having mirrored circuitry
  • Integrated circuit device with stacked dies having mirrored circuitry
  • Integrated circuit device with stacked dies having mirrored circuitry

Examples

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Embodiment Construction

[0017] This article describes integrated circuit devices and techniques for their fabrication. Integrated circuit devices utilize two or more pairs of stacked integrated circuit die fabricated in a mirrored fashion to reduce manufacturing complexity. Using an IC die with circuitry formed as a mirror image allows the development and qualification of a single mask set whose mirror image can be utilized to produce a second IC die at no additional cost and time A different second mask set for the second IC die is developed. Furthermore, pairs of mirror-image stacked integrated circuit dies allow die stacks of four or more IC dies to be fabricated with a reduced number of carrier attach and detach operations during device fabrication. Therefore, the cost and time required to manufacture integrated circuit devices are further reduced. Thus, a robust integrated circuit device is realized that has significant cost and production time advantages over conventional design and manufactu...

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Abstract

An integrated circuit device and techniques for manufacturing the same are described therein. The integrated circuit device leverages two or more pairs of stacked integrated circuit dies that are fabricated in mirror images to reduce the complexity of manufacturing, thus reducing cost. In one example, an integrated circuit device is provided that includes an integrated circuit (IC) die stack. The IC die stack includes first, second, third and fourth IC dies. The first and second IC dies are coupled by their active sides and include arrangements of integrated circuitry that are mirror images of each other. The third and fourth IC dies are also coupled by their active sides and include arrangements of integrated circuitry that are mirror images of each other.

Description

technical field [0001] Embodiments of the present invention relate generally to integrated circuit devices, and more particularly, to integrated circuit devices having stacked integrated circuit die with mirror circuits and methods of manufacturing the same. Background technique [0002] Electronic devices often use electronic components, which use chip packaging components to improve functionality and increase component density. Conventional chip packaging solutions typically utilize a packaging substrate and often incorporate through-silicon via (TSV) interposers to enable multiple integrated circuit (IC) die to be mounted on a single packaging substrate. An IC die may include memory, logic elements, or other IC devices. These electronic devices, which contain one or more chip packages, are often used in advanced electronic computing systems, such as are commonly found in telecom and datacom equipment, data centers, and automotive electronics. [0003] In many chip packa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/07H01L23/31
CPCH01L25/071H01L23/3128H01L25/0657H01L25/50H01L2224/16227H01L25/0652H01L2225/06513H01L2225/06517H01L2225/06524H01L2225/06541H01L2225/06565H01L2224/08145H01L2224/16145H01L2224/131H01L25/18H01L2224/80895H01L2224/80896H01L2224/09181H01L2924/014H01L2924/00014H01L21/50
Inventor M·金H·刘C·W·张
Owner XILINX INC