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Adhesive for LED lamp tube plate

A technology of LED lamp tubes and adhesives, applied in the direction of adhesive types, conjugated diene adhesives, adhesives, etc., can solve the problems of moisture absorption of polyimide film and epoxy glue, curling of copper clad laminates, and the impact of Sticking lamp bead technology and other issues

Pending Publication Date: 2021-08-27
广东高特高新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, single-sided copper-clad laminates are mostly used for LED lamp tube boards. When manufacturing single-sided copper-clad laminates, straight-chain bisphenol A resin is used and cured with imidazole. As a result, both the PI film and the adhesive are easier to absorb moisture. On the one hand, during the production and storage of ordinary single-sided copper-clad laminates, the polyimide film and epoxy glue will absorb moisture, causing the copper-clad laminates to curl and affect the subsequent lamp bead paste process, especially after reflow soldering. The curling situation is more serious, which greatly reduces the production efficiency of the lamp bead sticking process. On the other hand, it causes the LED lamp tube board to curl up during use, which affects the use

Method used

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  • Adhesive for LED lamp tube plate
  • Adhesive for LED lamp tube plate
  • Adhesive for LED lamp tube plate

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0043] The adhesive provided by the present invention for LED lamp tube board, by weight, the adhesive includes,

[0044] 15-45 parts of halogen-free epoxy resin, the halogen-free epoxy resin is low hygroscopic epoxy resin, and the halogen-free epoxy resin is dicyclopentadiene phenolic resin;

[0045] 15-45 parts of nitrile rubber;

[0046] 0.1-8 parts of curing agent;

[0047] Phosphorus-containing composite flame retardant 5-60 parts;

[0048] 0.1-5 parts of additives.

[0049] The curing agent includes imidazole curing agent and dicyandiamide curing agent.

[0050] In this embodiment, by weight, there are 15 parts of halogen-free epoxy resin, 45 parts of nitrile rubber, 5.95 parts of curing agent, 32 parts of phosphorus-containing composite flame retardant, 2 parts of auxiliary agent, and 0.05 parts of accelerator. share.

[0051] The adhesive provided by the present invention can be obtained by mixing and fully stirring the above materials. The stirring device can be ...

no. 2 example

[0058] The halogen-free epoxy resin is low moisture absorption epoxy resin, and the halogen-free epoxy resin is dicyclopentadiene phenolic resin.

[0059] The curing agent includes imidazole curing agent and dicyandiamide curing agent.

[0060] In this embodiment, by weight, there are 30 parts of halogen-free epoxy resin, 30 parts of nitrile rubber, 5.95 parts of curing agent, 32 parts of phosphorus-containing composite flame retardant, 2 parts of auxiliary agent, and 0.05 parts of accelerator. share.

[0061] The adhesive provided by the present invention can be obtained by mixing and fully stirring the above materials. The stirring device can be a known stirring device. The adhesive provided by the present invention uses a halogen-free epoxy resin with low hygroscopicity. Chain resin to avoid moisture absorption. On the one hand, the copper clad laminate does not need to be curled due to moisture absorption, which ensures the production efficiency of the subsequent lamp bea...

no. 3 example

[0068] The halogen-free epoxy resin is low moisture absorption epoxy resin, and the halogen-free epoxy resin is dicyclopentadiene phenolic resin.

[0069] The curing agent includes imidazole curing agent and dicyandiamide curing agent.

[0070] In this embodiment, by weight, there are 35 parts of halogen-free epoxy resin, 30 parts of nitrile rubber, 5.95 parts of curing agent, 27 parts of phosphorus-containing composite flame retardant, 2 parts of auxiliary agent, and 0.05 parts of accelerator. share.

[0071] The adhesive provided by the present invention can be obtained by mixing and fully stirring the above materials. The stirring device can be a known stirring device. The adhesive provided by the present invention uses a halogen-free epoxy resin with low hygroscopicity. Chain resin to avoid moisture absorption. On the one hand, the copper clad laminate does not need to be curled due to moisture absorption, which ensures the production efficiency of the subsequent lamp bea...

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Abstract

The invention relates to an adhesive for an LED lamp tube plate, which comprises the following components in parts by weight: 15-45 parts of halogen-free epoxy resin which is low-hygroscopicity epoxy resin; 15-45 parts of nitrile rubber; 0.1-8 parts of a curing agent; 5-60 parts of a phosphorus-containing composite flame retardant; and 0.1-5 parts of an auxiliary agent. The halogen-free epoxy resin with low hygroscopicity is adopted, conventional straight-chain resin is omitted, the moisture absorption condition is avoided, on one hand, the copper-clad plate does not need to be curled due to the moisture absorption condition, the production efficiency of the follow-up lamp bead pasting process is guaranteed, on the other hand, deformation of the LED lamp tube plate caused by curling of the copper-clad plate is avoided, the lamp tube plate material is not prone to curl in the using process, adverse effects on use of the LED lamp tube plate are avoided, and the service life of the LED lamp tube plate is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of LED lamp tube boards, and in particular relates to an adhesive used for LED lamp tube boards. Background technique [0002] At present, single-sided copper-clad laminates are mostly used for LED lamp tube boards. When manufacturing single-sided copper-clad laminates, straight-chain bisphenol A resin is used and cured with imidazole. As a result, both the PI film and the adhesive are easier to absorb moisture. On the one hand, during the production and storage of ordinary single-sided copper-clad laminates, the polyimide film and epoxy glue will absorb moisture, causing the copper-clad laminates to curl and affect the subsequent lamp bead paste process, especially after reflow soldering. The curling situation is more serious, which greatly reduces the production efficiency of the lamp bead sticking process. On the other hand, it causes the LED lamp tube board to curl during use, which affects the use. Co...

Claims

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Application Information

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IPC IPC(8): C09J109/02C09J163/00C09J11/00
CPCC09J109/02C09J163/00C09J11/00C08L2201/02C08L2201/22C08L2201/08
Inventor 彭树荣刘佳鑫
Owner 广东高特高新材料有限公司
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