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Physical coarsening electroplating device and process for replacing harmful hexavalent complex coarsening

An electroplating device and roughening technology, applied in the direction of electrolysis process, electrolysis components, etc., can solve the problems of limited plating solution contact, poor electroplating effect, and inability to perform plating, so as to improve the flexibility of use, improve the effect of plating, and improve the electroplating effect. effect of effect

Active Publication Date: 2021-08-31
深圳市金源康实业有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the physical roughening electroplating device, the workpiece to be plated is fixed during electroplating, and the contact with the surrounding plating solution is limited. Only the method of directly inflating and stirring at the bottom cannot change this shortcoming, resulting in poor electroplating effect. The speed is slow, and the parts to be plated with holes will have contact blind spots regardless of any kind of stable method of hanging, clamping or supporting, and these contact points cannot be coated because they are covered, and secondary coating is required, so the increase The workload of the coating, and the uniformity of the coating is not uniform

Method used

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  • Physical coarsening electroplating device and process for replacing harmful hexavalent complex coarsening
  • Physical coarsening electroplating device and process for replacing harmful hexavalent complex coarsening

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Embodiment Construction

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0037] refer to figure 1 , a physical roughening electroplating device that replaces the coarsening of harmful hexavalent networks, including an electroplating box 1 and anode parts 2 arranged at both ends of the inner side of the electroplating box 1, electroplating solution is injected into the electroplating box 1, and the anode part 2 is connected to an external power supply. The anode is electrically connected, and a heating element 3 is arranged on the e...

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Abstract

The invention relates to the technical field of electroplating, and discloses a physical coarsening electroplating device and process for replacing harmful hexavalent complex coarsening. The physical coarsening electroplating device comprises an electroplating box and anode pieces arranged at the two ends of the inner side of the electroplating box, the anode pieces are electrically connected with an anode of an external power supply, and a cathode electroplating mechanism is arranged in the middle of a frame plate; the cathode electroplating mechanism comprises a gas guide part and a cathode wire arranged on the outer side of the gas guide part, the cathode wire is electrically connected with a cathode of the external power source, a plating piece supporting part is arranged at the lower end of the gas guide part, and the tail end of the cathode wire is fixedly connected with the plating piece supporting part. The electroplating device and process have the beneficial effects that in the whole process, the plating piece supporting part slightly rotates while moving downwards, the contact amount of a to-be-plated piece and electroplating liquid is increased, and the electroplating effect is improved.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a physical roughening electroplating device and process for replacing harmful hexavalent network roughening. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation. Improve wear resistance, electrical conductivity, reflective properties, corrosion resistance and improve appearance. The outer layer of many coins is also electroplated. There are many kinds of electroplating methods. Physical roughening electroplating is a common electroplating method. For the safety of electroplating operators, electroplating methods have now replaced harmful hexavalent network coarsening. plating. [0003] However, in the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/00C25D17/08C25D5/08C25D5/00
CPCC25D17/00C25D17/08C25D5/08C25D5/003
Inventor 胡栋明
Owner 深圳市金源康实业有限公司
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