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Wafer processing device

A processing device and wafer technology, applied in metal processing equipment, manufacturing tools, cleaning methods using tools, etc., can solve the time-consuming and labor-intensive problems of manual cleaning of chucks

Active Publication Date: 2021-09-07
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a wafer processing device to solve the time-consuming and labor-intensive problem of manually cleaning the chuck in the related art

Method used

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Embodiment Construction

[0041] In order to clearly understand the technical solutions of the present application, firstly, the solutions of related technologies are introduced in detail.

[0042] Chip manufacturing equipment is usually provided with a chuck capable of absorbing wafers, and a rotating device capable of driving the chuck to rotate is provided at the bottom of the chuck. After a large number of wafers enter and leave the equipment chamber, the chuck may be contaminated, which reduces the chuck's ability to adsorb wafers. When the rotating device drives the chuck to rotate at a high speed, the wafer may be detached from the chuck, resulting in fragments, which will affect the normal operation time of the machine. After using for a period of time, the wafer chuck is usually cleaned manually by using cleaning tools such as dust-free cloth or alcohol during equipment maintenance. Due to the complex internal device of the equipment, the manual cleaning operation is complicated, time-consumi...

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PUM

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Abstract

The embodiment of the invention belongs to the technical field of semiconductor manufacturing equipment, and particularly relates to a wafer processing device. The chuck cleaning device is used for solving the problem that manual chuck cleaning wastes time and labor in the prior art. A rotating device is in transmission connection with a chuck; a detection device is used for detecting pollutants on the chuck; a grinding device is connected with a first driving device; a control device is connected with the rotating device, the detection device, the first driving device and a first suction device; the control device is used for controlling the first driving device to drive the grinding device to make contact with the chuck when the detection device detects that the chuck has pollutants, the control device further controls the rotating device and the first suction device to work so as to enable the chuck to rotate; the first suction device sucks the pollutants ground by the grinding device, so the pollutants on the chuck are removed by the first cleaning device; compared with a mode of manually cleaning the chuck, the wafer processing device simplifies the cleaning operation of the chuck, and saves time and labor.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of semiconductor manufacturing equipment, and in particular, to a wafer processing device. Background technique [0002] In chip manufacturing equipment, in order to accurately fix the wafer to be processed, a chuck capable of absorbing the wafer is usually provided inside the cavity of the equipment, and a rotating device capable of driving the chuck to rotate is provided at the bottom of the chuck. During the working process of the equipment, a large number of wafers enter and exit the equipment cavity, which may cause the chuck to be contaminated, which reduces the chuck's ability to absorb wafers. When the rotating device drives the chuck to rotate at a high speed, the wafer may be detached from the chuck, resulting in fragments, which will affect the normal operation time of the machine. [0003] In the related art, after a period of use, the wafer chuck is usually manually cleane...

Claims

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Application Information

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IPC IPC(8): H01L21/683B08B1/02B08B5/04B24B27/033
CPCH01L21/6838B08B5/043B24B27/033B08B1/20B08B1/12
Inventor 梁学玉
Owner CHANGXIN MEMORY TECH INC