Light-emitting component

Abstract

The invention provides a light-emitting component, which includes a semiconductor structure, a reflective structure, first and second insulating structures, a conductive structure, and first and second pads, wherein the reflective structure is disposed on the semiconductor structure; the first insulating structure comprises a first protruding part and a second protruding part which respectively cover the first part and the second part of the reflective structure, and a first concave part which exposes a third part between the first part and the second part; the conductive structure includes first and second conductive parts; the first conductive part is disposed on the first protruding part to contact the semiconductor structure; the second conductive part is disposed on the second protruding part and contacts the third part through the first concave part; the first and second pads are respectively disposed on the first and second conductive parts; and all the structures under the first pad and the second pad are stacked in a flat shape so as to improve stress resistance.

Description

technical field [0001] The present disclosure relates to a light-emitting device, and in particular to a flip-chip light-emitting device. Background technique [0002] Light Emitting Diode (LED) is a light-emitting element made of semiconductor materials, which can convert electrical energy into light. It has the advantages of small size, high energy conversion efficiency, long life, and power saving, so it is widely used in various electronic products. The light source of the device. [0003] Although the current flip-chip LED improves the luminous efficiency of the traditional LED, it suffers from uneven current diffusion resulting in low luminous brightness, and the uneven eutectic surface leads to low stress resistance. In view of this, the prior art needs to be improved. Contents of the invention [0004] The purpose of an embodiment of the present disclosure is to provide a light-emitting device to achieve the effects of uniform light emission and high stress resis...

AI Technical Summary

Problems solved by technology

[0003] Although flip-chip LEDs have improved the luminous efficiency of traditional LEDs, they suffer from uneven current diffusion, resulting in low luminous brightness, and low stress resistance due to uneven eutectic surfaces.

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