Label secondary injection molding method
A secondary injection molding and labeling technology, which is applied in the direction of coating, etc., can solve the problems of short service life and poor sealing effect of labels
Active Publication Date: 2021-09-10
莆田市多容光学电子有限公司
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- Abstract
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Problems solved by technology
[0004] The technical problem to be solved by the present invention is to provide a secondary injection molding method for the label, which solves the problem of poor sealing effect and short service life of the label caused by the positioning of the existing fixed positioning pin
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[0051] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is some embodiments of the present invention, but not all of them. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention.
[0052] see Figure 1 to Figure 18 As shown, a preferred embodiment of a label ...
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The invention provides a label secondary injection molding method. The label secondary injection molding method comprises the following steps that an upper mold plate is separated from a lower mold plate, a label carrier loaded with an electronic component is placed in a label carrier positioning groove, and the label carrier is positioned in the label carrier positioning groove through a first movable positioning pin mechanism and a second movable positioning pin mechanism; the upper mold plate and the lower mold plate are closed and fixed, plastic fluid is injected into the label carrier positioning groove and an injection molding groove through a feeding runner, and the first movable positioning pin mechanism and the second movable positioning pin mechanism exit outwards under the extrusion force of the plastic fluid and are separated from the label carrier; gaps between the first movable positioning pin mechanism and the label carrier and between the second movable positioning pin mechanism and the label carrier are filled with the plastic fluid; and after the plastic fluid is molded into a plastic coating shell outside the label carrier, the upper mold plate and the lower mold plate are demolded and separated. The label secondary injection molding method has the advantages that the sealing effect of a finally-produced electronic tag can be guaranteed, and the service life of the electronic tag is prolonged.
Description
【Technical field】 [0001] The invention relates to the field of label production, in particular to a label secondary injection molding method. 【Background technique】 [0002] Electronic tags are also called radio frequency tags, transponders, and data carriers; electronic tags can play the role of identification, item tracking, and information collection. At present, electronic tags are widely used in many fields such as industrial automation and commercial automation. The electronic tag is composed of a coupling element and a chip. In order to protect the coupling element and chip in the electronic tag, after the coupling element and chip are mounted on the label carrier, it is necessary to re-inject a layer outside the label carrier. The outer wrapping layer, so as to realize the protection of the coupling element and the chip. [0003] For overmolding on the outside of the label carrier, the label carrier needs to be positioned. The prior art uses fixed positioning pins...
Claims
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Login to View More IPC IPC(8): B29C45/14B29C45/26B29C45/46
CPCB29C45/2602B29C45/14065B29C45/46
Inventor 张元和林万金黄清冰
Owner 莆田市多容光学电子有限公司