Thermal interface material automatic measurement equipment
A thermal interface material, automatic measurement technology, applied in measurement devices, analytical materials, thermal analysis of materials, etc., can solve problems such as inability to adapt to material performance measurement, and achieve the effect of reducing operating pressure
Active Publication Date: 2021-11-16
长沙先进电子材料工业技术研究院有限公司
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[0005] In order to solve the technical problem that the thermal interface material measurement equipment in the prior art cannot adapt to the performance measurement of thermal interface materials under various interfaces, the present invention provides an automatic thermal interface material measurement equipment that solves the above problems
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[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.
[0020] Please also see Figure 1~Figure 3 , are respectively a structural schematic diagram of the thermal interface material automatic measuring device 1 provided by the present invention, and partial enlarged views of two different positions thereof.
[0021] It should be noted that the drawings are only for reference, and are not drawn strictly according to the size and proportion of parts, nor are the section lines drawn strictly according to the section structure.
[0022] The thermal interface material automatic measurement device 1 includes a casing 11, a movable door 12, a controller 13, a first moving mechanism 14, a second moving mechanism 15, a heating mec...
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The invention provides an automatic measuring device for a thermal interface material. The thermal interface material automatic measurement equipment includes a first metal block, a second metal block, a heating mechanism and a cooling mechanism respectively arranged on the two; The first moving mechanism and the second moving mechanism of the inner wall of the housing; the movable end of the first moving mechanism is provided with the heating mechanism and the first metal block in turn, and is connected with the adjacent movable door through a linkage mechanism Connection; the movable end of the second moving mechanism is provided with the cooling mechanism and the second metal block in turn, and is connected with the adjacent movable door through another linkage mechanism. The thermal interface material automatic measurement device provided by the present invention solves the technical problem that the thermal interface material measurement device in the prior art cannot adapt to the performance measurement of thermal interface materials under various interfaces.
Description
technical field [0001] The invention relates to the field of thermal interface materials, in particular to an automatic measurement device for thermal interface materials. Background technique [0002] In recent years, with the rapid development of the integration process of semiconductor components, the integration level of semiconductor components is getting higher and higher, and the requirements for heat dissipation are also higher. Since the contact interface between the radiator and the semiconductor integrated component is not smooth, there must be some gaps or cavities between them, and the thermal conductivity of air is very low, which greatly affects the heat transfer effect of the semiconductor component to the radiator. At present, thermal interface materials are generally coated on the contact surface to solve the above-mentioned problems. [0003] During the development of thermal interface materials, samples are often tested to determine their thermal conduct...
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IPC IPC(8): G01N25/00
CPCG01N25/00
Inventor 周佩先岳利俞国金
Owner 长沙先进电子材料工业技术研究院有限公司