Power semiconductor device large-current turn-off capability detection device

Abstract

The invention discloses a power semiconductor device large-current turn-off capability detection device. The device structurally comprises a lower box body, an operation panel, a display screen, an upper box body, a plugging port, a hinge, a detection wire, a jointing clamp and a winding device, when the power semiconductor device large-current turn-off capability detection device is used, the detection wire is wound and sleeved between a limiting clamping plate and a winding reel layer by layer; the two ends of the detection wire extend into wire cavities respectively, the ends of the two ends of the detection wire are clamped to a first interface and a second interface respectively, when the detection wire needs to be used, a worker presses an adjusting assembly, the detection wire is pulled out manually, and when the distance is reached, the adjusting assembly is pressed again, the adjusting assembly is pressed to abut against and fix the winding reel, so that the winding reel is not easy to rotate, the detection wire is effectively wound, the detection wire is prevented from being scattered outside, and the device can stably detect a device.

Description

technical field [0001] The invention relates to the field of high-power semiconductor devices, in particular to a detection device for high-current turn-off capability of power semiconductor devices. Background technique [0002] With the rapid development of power electronics technology and high-voltage direct current transmission technology, electronic products have gradually entered the direction of multi-functional and high-performance research and development. It is necessary to evaluate and detect the performance indicators of power semiconductor devices, and basic dynamic and static parameter tests can be performed on them. As well as the general reliability test, the electric wire is rewound by the rewinding element. When testing the power semiconductor device, the areas that need to be improved are: [0003] When testing power semiconductor devices, the chuck is connected to the semiconductor device for testing. During the testing process, the staff needs to use wir...

AI Technical Summary

Problems solved by technology

[0003] When testing power semiconductor devices, the chuck is connected to the semiconductor device for testing. During the testing process, the staff needs to use wires. Due to the long length of the wires, the two wires will all be scattered during use. The wires are entangled and doped together, and the scattered wires take up a lot of space, and when the equipment is moving, the wires may be dragged on the ground, requiring staff to clean them up manually, which affects the detection accuracy of power semiconductor devices and reduces power consumption. Detection efficiency of semiconductor devices

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