Plastic uptake heating forming device

Abstract

The invention discloses a plastic uptake heating forming device, and relates to the technical field of plastic forming. The device comprises a bottom device, an adjusting device, a heating device and a purifying device, wherein the bottom device is arranged at the bottom of the adjusting device and fixedly connected to the adjusting device, the heating device is arranged in the adjusting device and fixedly connected to the adjusting device, the purifying device is arranged at the top of the adjusting device, and the purifying device is fixedly connected to the adjusting device. According to the plastic uptake heating forming device, by arranging the heating device, a heating plate can be driven to horizontally and circularly move at the bottom of a plastic plate, the plastic plate can be comprehensively and uniformly heated through horizontal and circular movement of the heating plate, heating dead angles are avoided, then the plastic forming quality can be improved, by arranging the adjusting device, the height from the heating plate to the plastic plate can be adjusted so that the distance between the heating plate and the plastic plate can be adjusted according to actual needs, and the use range and practicability of the whole device are expanded.

Description

technical field [0001] The invention belongs to the technical field of plastic molding, in particular to a thermoforming device for blistering. Background technique [0002] Thermoforming devices are often used when molding plastics. However, existing thermoforming devices still have certain deficiencies in use. Existing thermoforming devices often appear to heat the plastic unevenly. phenomenon, thereby reducing the quality of plastic molding. At the same time, when heating plastic, the heating device is often fixed, and the height of the heating device cannot be adjusted according to actual needs. The range of use is limited and the practicability is poor. Therefore, we To improve this, a blister thermoforming device is proposed. Contents of the invention [0003] The object of the present invention is to provide a thermoforming device for absorbing plastics to solve the existing problem: the existing thermoforming device tends to heat the plastic unevenly when in use, ...

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a thermoforming device for absorbing plastics to solve the existing problem: the existing thermoforming device tends to heat the plastic unevenly when in use, thereby reducing the quality of plastic molding, and at the same time When heating plastic, the heating device is often fixed, and the height of the heating device cannot be adjusted according to actual needs. The range of use is limited and the practicability is poor.

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