Feeding protection equipment for semiconductor materials

Abstract

The invention discloses feeding protection equipment for semiconductor materials. The equipment comprises a feeding transmission frame, a first transmission rotating rod is movably sleeved with one side of the feeding transmission frame, the middle of the outer surface of the first transmission rotating rod is fixedly sleeved with a connecting frame, the outer surface of the connecting frame is fixedly connected with a rotating connecting assembly, one side of the outer surface of the feeding transmission frame is fixedly sleeved with a first outer lantern ring, one side of the outer surface of the connecting frame is fixedly connected with a limiting adjusting frame, the middle of the limiting adjusting frame is movably sleeved with a limiting adjusting screw rod, and one side of the limiting adjusting screw rod is movably connected with a connecting rotating rod. According to the equipment, through mutual cooperation of clamping arms, a reciprocating elastic frame and other assemblies, the clamping arms can be stressed and contracted during clamping, so that the clamping arms are suitable for clamping of different materials, the clamping stability is provided, the feeding protection performance is improved, meanwhile, the stretching size is changed, feeding of the various materials is facilitated, and the machining efficiency is greatly improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor feeding equipment, more specifically, the invention relates to a feeding protection equipment for semiconductor materials. Background technique [0002] Semiconductor materials can be classified according to their chemical composition, and then the amorphous and liquid semiconductors with special structures and properties are classified as a separate category. According to this classification method, semiconductor materials can be divided into elemental semiconductors, inorganic compound semiconductors, organic compound semiconductors and Amorphous and liquid semiconductors. [0003] When the existing semiconductor is processed and produced, it needs to transport and load the material, and then load the semiconductor material into the designated processing device, and then process it. When loading the material, the existing feeding device does not have an effective The protective properties...

AI Technical Summary

Problems solved by technology

[0003] When the existing semiconductor is processed and produced, it needs to transport and load the material, and then load the semiconductor material into the designated processing device, and then process it. When loading the material, the existing feeding device does not have an effective The protective properties are all conveyed by components such as conveyor belts. There is no stabilizing mechanism on both sides of the conveyor belt to limit and stabilize the material so that during the feeding process, the transmission force in the conveyor belt and the moving process The vibration and friction force generated in the process can easily cause the material to shift, resulting in inaccurate material feeding position and inability to achieve complete feeding. In addition, the existing feeding device can only be used for mobile transportation, not automatic The integrated feeding and processing of materials has low versatility and processing efficiency, and cannot improve the efficiency of material feeding and processing. Finally, the existing feeding device does not have multi-directionality. The material is processed in multiple directions, so that it can only be processed on one side. After processing, the staff needs to turn over the processing. This processing step is complicated, which is not conducive to the feeding processing of the material, which greatly affects the processing efficiency, and is not conducive to semiconductors. production

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