A kind of quartz crystal oscillator grinding frame
A crystal oscillator and quartz technology, applied in the field of quartz crystal oscillator grinding frame, can solve problems such as low processing efficiency and achieve the effect of quick pick and place
Active Publication Date: 2022-02-15
深圳市科源信科技有限公司
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Problems solved by technology
[0005] The present invention mainly aims at the above problems, and proposes a quartz crystal vibrating plate grinding frame, aiming at solving the problem of low processing efficiency caused by multiple pick-and-place for measuring the grinding thickness of the quartz crystal vibrating plate in the prior art
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[0029] The present invention will be described in detail below in conjunction with the accompanying drawings, and the technical solutions in the embodiments of the present invention will be clearly and completely described. Apparently, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0030] It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or there can also be an intervening component. When a component is said to be "connected" to another component, it may be directly connected to the other component or there may be intervening components at the same time. When a component is said to be "set on" another component, it may be set directly on the other comp...
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The invention discloses a grinding frame of a quartz crystal oscillator, comprising a worktable, a grinding disc and an annular liquid guiding part are arranged on the worktable, the annular liquid guiding part has a liquid guiding groove and a flow channel cavity, and the liquid guiding groove is provided with a liquid outlet The annular liquid-guiding part is provided with a liquid-guiding interface; the grinding disc has a negative pressure chamber and an adsorption hole, the back side of the grinding disc is provided with a rod shaft, the rod shaft has an air passage hole, and one end of the air passage hole is communicated with the negative pressure chamber; The worktable is fixedly connected with an air plate and a vertical rod, the air plate has an extension part, the air hole is arranged on the extension part, and the corresponding extension part of the worktable is provided with an air channel slot; the outer wall of the vertical rod is provided with a gas pipe interface, and the end of the vertical rod is provided with a mounting Plate, the rod shaft is provided with a gear on the back side of the mounting plate, the mounting plate is provided with a rotating shaft, and the rotating shaft is provided with a gear part meshing with the gear; the present invention proposes a quartz crystal oscillator sheet grinding frame, which aims to solve the problem of the prior art. In order to measure the grinding thickness of the quartz crystal, the problem of low processing efficiency caused by multiple pick and place.
Description
technical field [0001] The present application relates to the technical field of crystal oscillator processing, in particular to a grinding frame for quartz crystal oscillators. Background technique [0002] It should be noted that the contents recorded in this section do not represent all prior art. [0003] Quartz wafer is the core component of crystal oscillator. Quartz crystal oscillator (crystal oscillator) provides time reference for electronic equipment and plays an extremely important role in the electronic information industry. It mainly plays the role of frequency generation, has the characteristics of stability and good anti-interference performance, and is widely used in various electronic products. Quartz wafers need to go through multiple processing procedures in the production process. In the production process of quartz wafers, the quartz crystal raw materials must first be cut and ground, and a layer of pure silver is coated on the cut quartz wafers to impr...
Claims
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IPC IPC(8): B24B37/10B24B37/30B24B37/34B24B47/12B24B27/00
CPCB24B37/10B24B37/30B24B37/34B24B27/0023B24B47/12
Inventor 杨燕旋杨丽旋
Owner 深圳市科源信科技有限公司