Substrate pick-and-place device and pick-and-place method

Abstract

The invention provides a substrate pick-and-place device and a pick-and-place method. The substrate pick-and-place device includes at least one robotic arm, a plurality of substrate forks are arranged on the robotic arm, and each substrate fork is provided with a plurality of vacuum suction cups and a CDA pipeline connected with the plurality of vacuum suction cups; There are also multiple pressure electronic gauge heads and multiple solenoid valves. Any pressure electronic gauge head corresponds to measuring the vacuum degree of multiple vacuum suction cups on any substrate fork, and any solenoid valve corresponds to control any substrate fork. The on-off of the CDA pipeline. In the present invention, a plurality of solenoid valves are arranged, and any solenoid valve controls the on-off of the CDA pipeline on any substrate fork correspondingly. When the number of vacuum suction cups whose vacuum degree reaches the preset range meets the requirements, the solenoid valve can The CDA pipeline corresponding to the vacuum suction cup whose vacuum degree does not reach the preset range is disconnected, so as to avoid the alarm and shutdown of the machine, which can effectively improve the abnormal vacuum suction of the robot arm and improve the stability of the substrate pick-and-place device.

Description

technical field [0001] The present invention relates to the field of display technology, and in particular, to a substrate pick-and-place device and a pick-and-place method. Background technique [0002] In the production process of the display panel, a magnetron sputtering equipment is usually used for the coating process. In the coating process, it is usually necessary to use a robotic arm to adsorb the glass substrate, and then flip the glass substrate from a horizontal state to a vertical state, or from a vertical state to a horizontal state. During the adsorption process, because the area of ​​the glass substrate is too large (2940mm*3370mm), an abnormal vacuum suction will inevitably occur (referring to the poor contact between the suction cup and the glass substrate in the vacuum state, resulting in insufficient vacuum degree and vacuum Not reaching the alarm). [0003] The existing robotic arm is provided with 7 substrate forks, each substrate fork is provided with...

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides a substrate pick-and-place device, which is used to solve the technical problems of abnormal vacuum suction in the substrate pick-and-place device in the prior art, which leads to machine downtime and low production efficiency.

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