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Solid-state multi-switch device

An electronic solid-state switch and device technology, applied in the direction of electric solid-state devices, semiconductor/solid-state device components, electronic switches, etc., can solve the problems of large volume, high power consumption, and unsuitability for integrated solid-state switches

Pending Publication Date: 2021-09-17
GM GLOBAL TECH OPERATIONS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Existing gate driver circuits are designed for inverter applications, consume high power, are bulky, and are not suitable for integration into solid-state switches

Method used

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  • Solid-state multi-switch device
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Experimental program
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Embodiment Construction

[0094] As described and illustrated herein, the components of the disclosed embodiments may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description is not intended to limit the scope of the claimed disclosure, but is merely representative of possible embodiments thereof. Furthermore, although numerous specific details are set forth in the following description in order to provide a thorough understanding of the embodiments disclosed herein, some embodiments can be practiced without these details. Also, for the sake of clarity, certain technical material that is understood in the related art has not been described in detail to avoid unnecessarily obscuring the present disclosure. Directional terms such as top, bottom, left, right, up, above, above, below, below, rear and forward may be used with reference to the figures for convenience and clarity only. These and similar directional terms should not be construed to lim...

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Abstract

A solid-state switch assembly includes a base plate and an electrically insulating layer affixed to the base plate. First, second, third, and fourth power traces are affixed to the electrically insulating layer. First semiconductor devices are arranged on the first power trace to control power flow between the first power trace and the second power trace, second semiconductor devices are arranged on the second power trace to control power flow between the second power trace and the third power trace, and third semiconductor devices are arranged on the third power trace to control power flow between the third and fourth power traces. A first signal conductor communicates with the first semiconductor devices. A second signal conductor communicates with the second semiconductor devices. A third signal conductor communicates with the third semiconductor devices.

Description

Background technique [0001] An on-board battery system may employ multiple battery packs arranged to supply high voltage DC power to an electrified powertrain. The battery packs may be arranged in parallel to supply power to the electrified powertrain for operation, and in series during recharging. [0002] Existing gate driver circuits are designed for inverter applications, consume high power, are bulky, and are not suitable for integration into solid-state switches. If the power supply has significant inductance, the solid-state switch cannot absorb high energy during disconnection under short-circuit or overload conditions. Therefore, there is a need to develop low-power and compact gate drivers and protection circuits for solid-state switches. Additionally, there is a need for a switching device capable of delivering power for electrified powertrain operation and charging, compact in size, light in weight, capable of managing temperature, having fast switching speeds, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03K17/687
CPCH03K17/687H01M10/425H01M10/441H01M2220/20Y02E60/10H01L23/5386H01L25/072H01L23/3735H01L2224/49111H01L2224/49113H01L2224/48227H02J7/0024H02J7/0063H01M50/502
Inventor C·S·那慕杜理R·普拉萨德
Owner GM GLOBAL TECH OPERATIONS LLC