Assembly and method suitable for sputtering ring batch electron beam welding

A technology of electron beam welding and vacuum electron beam welding, which is applied in the field of magnetron sputtering, can solve the problems of low vacuum electron beam welding efficiency, save multiple times of vacuuming and cooling time, improve production efficiency, and combine conveniently and flexibly Effect

Active Publication Date: 2021-09-24
GRIKIN ADVANCED MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The efficiency of vacuum electron beam welding is low. The objective factor is that welding needs to be carried out in a vacuum environment. Vacuuming is required before welding. After the workpiece is welded, the workpiece needs to be cooled. Each welding vacuuming and cooling takes time.

Method used

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  • Assembly and method suitable for sputtering ring batch electron beam welding
  • Assembly and method suitable for sputtering ring batch electron beam welding
  • Assembly and method suitable for sputtering ring batch electron beam welding

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Such as image 3 Shown is a schematic diagram of the assembly when welding a four-piece sputtering ring. After the mandrel 101 is fixed on the chuck of the vacuum electron beam welding machine and adjusted, a separator 102 is first installed on the mandrel 101, and then the sputtering ring 200 and the separator 102 are installed in sequence, and a total of 4 times of sputtering are installed. Ring 200, partition 102, and finally install the baffle 105 behind the last partition, adjust the relative positions of the supports 203 and electrodes 202 of the four sputtering rings 200, so that the supports 203 of the four sputtering rings 200 are in parallel On the same straight line of the center line of the mandrel, the electrodes 202 of the four sputtering rings 200 are located on the same line parallel to the center line of the mandrel, and the bolts 103 are tightened to push the apex on the vacuum electron beam welding machine table to the bolts 103 , so that the sputter...

Embodiment 2

[0032] Such as Figure 4 Shown is a schematic diagram of the assembly when welding three sputtering rings. After the mandrel 101 is fixed on the chuck of the vacuum electron beam welding machine and adjusted, a partition 102 is installed on the mandrel 101 first, and then the sputtering rings are installed in sequence. The ring 200 and the separator 102 are installed three times in total. The sputtering ring 200 and the separator 102 are installed three times. On the same straight line of the mandrel center line, the electrodes 202 of the three sputtering rings 200 are located on the same line parallel to the mandrel center line, the first sleeve 104 is inserted into the mandrel 101, and finally the baffle plate 105 After being installed on the first sleeve 104, the bolt 103 is tightened, and the top of the workbench of the vacuum electron beam welding machine is pushed onto the bolt 103, so that the sputtering ring batch welding assembly is installed. Close the furnace door ...

Embodiment 3

[0034] Such as Figure 5 Shown is a schematic diagram of the assembly when welding two sputtering rings. After the mandrel 101 is fixed on the chuck of the vacuum electron beam welding machine and adjusted, a partition 102 is installed on the mandrel 101 first, and then the sputtering rings are installed in sequence. Ring 200, partition 102, install sputtering ring 200 and partition 102 three times in total, adjust the relative positions of supports 203 and electrodes 202 of the two sputtering rings 200, so that the supports 203 of the two sputtering rings 200 are in parallel On the same straight line of the mandrel center line, the electrodes 202 of the two sputtering rings 200 are located on the same line parallel to the mandrel center line, the second sleeve 106 is inserted into the mandrel 101, and finally the baffle plate 105 After being installed on the second sleeve 106, the bolt 103 is tightened, and the top of the workbench of the vacuum electron beam welding machine ...

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Abstract

The invention provides a sputtering ring batch electron beam welding assembly and method. The sputtering ring batch electron beam welding assembly comprises a mandrel, partition plates, a sleeve, a baffle and a bolt, wherein the mandrel is fixed on a chuck of an electron beam welding machine, and the tail portion of the mandrel can be supported by a tailstock tip on a workbench of the electron beam welding machine. According to the assembly and method suitable for the sputtering ring batch electron beam welding, when sputtering rings are welded in batches, a plurality of sputtering rings can be installed at a time, every two partition plates fix one sputtering ring, and finally, the sputtering rings are fixed by the baffle and the bolt; and during welding, only parameters of coordinates, high voltage, beam current and linear speed of a supporting piece and an electrode of the first sputtering ring need to be set, and other sputtering rings can be automatically welded through programming. By means of the sputtering ring batch electron beam welding assembly and method, the time for multiple times of vacuumizing and cooling is shortened, the time for multiple times of coordinate parameter setting is also shortened, the production efficiency is improved, and the enterprise production cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of magnetron sputtering, in particular to a batch electron beam welding component and method suitable for sputtering rings. Background technique [0002] Magnetron sputtering is a thin film deposition technology commonly used in the production process of modern semiconductor chips. It uses high-energy particles to bombard a high-purity target, so that the target atoms escape from the surface and are evenly deposited on the substrate to form a uniform The thin film layer of the integrated circuit is formed on the substrate after grinding and polishing. The barrier layer, interconnection line and contact layer of the integrated circuit. In the cavity of the magnetron sputtering machine, the sputtering ring is a part used together with the corresponding target, placed between the target and the substrate, and its main function is to affect the sputtered target by the electromagnetic field generated by the elect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K15/06B23K37/04
CPCB23K15/06B23K37/0435
Inventor 张延宾张晓娜宋泽鹏李嘉郭凤岐丁照崇冯昭伟李武林邱明亮
Owner GRIKIN ADVANCED MATERIALS
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