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A chip and its pin outlet design method

A design method and chip technology, applied in computer-aided design, calculation, instruments, etc., can solve problems such as unprovided, chip pin outlet design quality is uneven, etc., to achieve the effect of refined design and guaranteed quality of outlet design

Active Publication Date: 2021-12-03
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the prior art does not provide a unified chip pin-out design for BGA-packaged chips, which are designed by designers based on their own experience, resulting in uneven chip pin-out design quality

Method used

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  • A chip and its pin outlet design method
  • A chip and its pin outlet design method
  • A chip and its pin outlet design method

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Experimental program
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Embodiment Construction

[0053] The core of the present invention is to provide a chip and pin line design method for providing a uniform chip BGA package design line of pin chips, and the design is more fine, thereby ensuring the quality of the design of the outlet pin chip.

[0054] In order to make the objects, technical solutions, and advantages of the present invention more clearly, the technical solutions in the embodiments of the present invention will be described in contemplation in the embodiment of the present invention. It is an embodiment of the invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art are in the range of the present invention without making creative labor premise.

[0055] Please refer to figure 1 , figure 1 A flowchart of a method of designing a chip-pin outlet according to an embodiment of the present invention.

[0056] Design of the outlet pin chip BGA package is applied ...

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PUM

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Abstract

The invention discloses a chip and a pin outlet design method thereof, which are applied to a BGA-packaged chip, and determine the number of circuit board layers required for the pin outlet of the chip according to the pin position information and pin definition information of the chip; Each is on the outgoing layer of the circuit board; according to the pin density of the chip and the width of the transmission line, determine the specifications of the vias on the circuit board used to lead the pins of the chip to the corresponding outgoing layer, so as to design the corresponding outgoing lines based on the vias. It can be seen that the present application provides a unified design of chip pin outlets for BGA-packaged chips, and the design is more refined, thereby ensuring the quality of chip pin outlet design.

Description

Technical field [0001] The present invention relates to the field of high-speed high-density chips, and more particularly to a chip and its PIN outline design method. Background technique [0002] In recent years, servers and communication products continue to pursue high-density miniaturization, resulting in increasing demand for chips, and with the development of high-speed transmission technology, the signal of chips is designed as high-speed signals. At present, high-speed high-density chips are encapsulated by BGA (Ball Grid Array, Grid Array), where the most critical link is the PIN (pin) outline design of the chip. However, there is no PIN wiring design for chip unified chips for BGA packaging, which is designed to be designed in accordance with their own experience, resulting in uniform quality of chip PIN. [0003] Therefore, how to provide a solution to the above technical issues is a problem that the problems currently needed in the art. Inventive content [0004] It ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/343
CPCG06F30/343G06F30/392G06F30/396G06F30/394G06F2113/18G06F2115/12H05K2201/09227H05K3/0005
Inventor 梁磊秦清松
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD
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