13 results about "Chip and PIN" patented technology

The application provides a manufacturing method of a power component and a power component packaging structure with high heat dissipation efficiency, and belongs to the technical field of semiconductors. The manufacturing method of the power component comprises the following steps: fixing a chip on a heat-conducting carrier plate, and connecting the chip and pins of the heat-conducting carrier plate through wires; sputtering an insulating film on the side of the heat-conducting carrier plate away from the chip; performing plastic sealing treatment on the heat-conducting carrier plate after sputtering the insulating film; and forming a heat dissipation layer on the surface of the plastic sealing body by film plating. The insulating film formed on the heat-conducting carrier plate by the sputtering method can reduce the manufacturing difficulty of the power component, improve the heat dissipation efficiency of the power component, and make the whole packaging structure smaller in size and thinner in thickness.

The utility model discloses an integrated circuit packaging outer structure which comprises a chip and pins. The LED lamp further comprises an upper shell, a lower shell, heat dissipation fins, a positioning structure and an installation structure. The chip is located in a space defined by the upper shell and the lower shell and is fixedly connected with the upper shell; the plurality of pins are uniformly distributed on the front side and the rear side of the lower shell; a rectangular limiting shoulder is arranged on the lower shell; the plurality of radiating fins are distributed on the upper surface of the upper shell; the positioning structure comprises a plurality of positioning blocks which are evenly distributed on the front side and the rear side of the upper shell, and positioning grooves capable of containing the positioning blocks are formed in the limiting shoulders. According to the utility model, through a detachable installation structure, rapid separation of the upper shell and the lower shell is realized, so that when faults occur at the end parts of the pins and packaged internal elements, the pins and the packaged internal elements can be disassembled for detection.

This application discloses a power module and a power conversion device, relating to the field of power electronics technology. The power conversion device provided in this application includes a chip, pins, a package structure, and a circuit board. The pins are electrically connected to the chip. The package structure encloses a portion of the chip and pins. Another portion of the pins extends from the first surface of the package structure to the outside of the package structure and is electrically connected to the circuit board. The first surface of the package structure includes a protrusion for fixed connection to the circuit board. Using the design scheme provided in this application, since the package structure is fixedly connected to the circuit board, it can limit the relative displacement between the package structure and the circuit board. Therefore, when the temperature of the power conversion device changes or it is subjected to impact or vibration, the reliability of the electrical connection between the pins and the circuit board can be guaranteed, and the increase in contact resistance between the two can be avoided, thereby improving the operational stability of the power conversion device.

This invention provides a packaging method for a CIS chip, including mounting the CIS chip onto a substrate; attaching a cover plate to the photosensitive area of ​​the CIS chip; connecting the pads and pins using bonding wires; placing a mold on the substrate, with the CIS chip and pins positioned within the mold; injecting adhesive or molding compound into the mold to cover the exposed chip surface, bonding wires, and exposed CIS chip surface within the mold; removing the mold, followed by delamination and die picking to complete the packaging of the CIS chip. The substrate is flat, eliminating the support structure. The method of placing the mold on the substrate and positioning the CIS chip and pins within the mold, and injecting adhesive or molding compound into the mold to cover the exposed chip surface, bonding wires, and exposed CIS chip surface within the mold, eliminates cavities, improves overall bonding strength, and creates thinning marks at the chip surface boundaries, eliminating the need for thick-cutting and thus improving warpage.

The utility model discloses a kind of mould for SBD device packaging, it includes: template and movable insert, the template top surface is recessed and is provided with the positioning slot corresponding with movable insert, the movable insert is reversibly and symmetrically set in positioning slot, the inner wall of the movable insert of both sides and positioning slot is enclosed with the packaging cavity corresponding with SBD device, the movable insert front end bottom recess is provided with the pressure groove corresponding with the pin of SBD device, the positioning pin between the positioning slot of both sides movable insert is provided with. The mould for SBD device packaging of the utility model realizes the positioning of the chip and pin of SBD device, and improves the stability in injection molding packaging process.

The invention provides a pin multiplexing circuit, an electronic chip, a sealing chip and a pin multiplexing method, and the pin multiplexing circuit comprises a power-on timing module which is used for starting the timing of a first time after the chip is powered on and generating an input state control signal, an input state control signal is maintained or an output state control signal is generated based on the input detection result in the first time; the input detection module is used for working under the action of the input state control signal, detecting whether an external signal is input at an output pin of the electronic chip and generating an input detection result; the output module is used for working under the action of the output state control signal and transmitting a signal to be output to an output pin; wherein the output pin is a bidirectional pin. According to the invention, the problem that the cost is increased when the ASIC chip is trimmed by adding the enabling pin in the prior art is solved.

The utility model relates to the technical field of burning equipment, in particular to a burning jig which comprises a jig seat, the top of the jig seat is respectively provided with a placing plate and a mounting frame, the top surface of the placing plate is provided with a chip groove, the inner wall of the bottom end of the chip groove is provided with a through hole, a contact mechanism is arranged between the placing plate and the jig seat, and the mounting frame is provided with a through hole. An electric sliding rail is arranged on the surface of the front side of the mounting frame, an electric sliding block is arranged in the electric sliding rail, a mounting plate is fixedly mounted on the front side of the electric sliding block, an electric push rod is arranged at the top of the mounting plate, a burner is arranged at the bottom of the mounting plate, and a burning pin is arranged at the bottom of the burner. According to the burning jig, the structural design in the contact mechanism and the arrangement of the supporting pressure spring are mainly used for applying pre-pressure to the bottom of the placing plate, flexible contact between a chip and a pin is achieved, damage to the chip caused by too large contact force is effectively avoided, and follow-up use is facilitated.

This invention discloses a dual-beam laser chip welding apparatus, welding method, and chip packaging structure, relating to the field of semiconductor packaging technology. The key technical points are: it includes a laser, a beam shaping element, bonding wires, and a control module. The surface of the bonding wires is covered with an absorption layer. The laser is configured to emit a first laser beam and a second laser beam with discrete functions. The first laser beam acts on the absorption layer to generate a plasma shock wave, causing the bonding wires to undergo plastic deformation and contact the bonding points of the chip and / or packaging substrate. The second laser beam, after being processed by the beam shaping element, converts a Gaussian beam into a flat-top beam, which directly irradiates the bonding points to provide welding heat. The control module is configured to adjust the laser parameters of the laser based on received feedback signals. This invention achieves clean welding of bonding wires to chips and pins while improving welding quality and efficiency.

The invention relates to a double-sided heat dissipation power device, and the power device comprises a first AMB board which comprises a first upper copper layer, a first insulating layer and a first lower copper layer which are sequentially arranged from the top to the bottom; the second AMB plate is arranged at the lower end of the first AMB plate, the second AMB plate comprises a second upper copper layer, a second insulating layer and a second lower copper layer which are sequentially arranged from top to bottom, and a notch is formed in the upper end of the second upper copper layer; a first AMB board and a second AMB board are stacked, a chip and a pin are clamped between the first AMB board and the second AMB board, and the chip is electrically connected with the pin through upper copper areas of the first AMB board and the second AMB board, so that packaging of the chip is completed, heat generated by the chip can be transferred through a first lower copper layer, a first insulating layer and a first upper copper layer of the first AMB board in sequence, and heat transfer efficiency is improved. And heat dissipation can be carried out through the second upper copper layer, the second insulating layer and the second lower copper layer of the second AMB plate, so that a double-sided heat dissipation path is formed, and the heat dissipation efficiency is improved.

The utility model discloses a QFN packaging structure, which comprises a heat dissipation substrate, a plurality of chips, a plurality of pins, a plurality of leads and a mold sealing body, and is characterized in that the heat dissipation substrate comprises a first metal layer, a ceramic layer and a second metal layer, the first metal layer, the ceramic layer and the second metal layer are sequentially stacked, and the first metal layer comprises a plurality of base islands which are mutually spaced; the plurality of chips are connected to the sides, back to the ceramic layer, of the corresponding base islands; the plurality of pins are arranged around the heat dissipation substrate, and the pins and the heat dissipation substrate are mutually spaced; the plurality of leads are electrically connected to the corresponding chips and the pins; the molding body covers the heat dissipation substrate, the chip, the pins and the leads, and part of the surfaces of the second metal layer and the pins are exposed out of the molding body. The embodiment can simplify the process steps and improve the efficiency.

The utility model discloses a packaging carrier tape for specifying MINI-DB bridge rectifier chips, which comprises a carrier tape, first notches are uniformly arranged on the carrier tape, second notches are arranged at two ends inside the first notches, a partition layer is formed between the middle parts inside the second notches, mounting holes are arranged at the bottoms of the first notches, and the mounting holes are communicated with the first notches. A fixing mechanism is mounted in the first notch; the fixing mechanism comprises a supporting plate located in the first notch, rubber extrusion blocks are fixed to the four corners of the supporting plate, a mounting piece penetrating through the mounting hole is mounted at the bottom of the supporting plate and comprises a connecting rod, a base plate is mounted at the bottom of the connecting rod, and the rubber extrusion blocks are fixed to the rubber extrusion blocks. The outer wall of the connecting rod is fixedly sleeved with a fixing ring located in the first notch, and the outer wall of the connecting rod is sleeved with a first spring. According to the utility model, the protection on the chips and the pins can be enhanced, and accessories can be selectively installed, so that the installation of the chips of different models is realized, and the stability is kept.

The invention relates to a heat dissipation structure of a GaN power device and a preparation method, the heat dissipation structure comprises a heat sink, the heat sink is provided with an input capacitor, an output capacitor, a monolithic power chip and a pin, and the heat sink is made of diamond copper; and the single power chip is adhered to the heat sink through the nano-silver adhesive. The preparation method comprises the steps of heat sink polishing, heat sink cleaning, nano-silver adhesive temperature returning, adhesive dispensing, single power chip bonding, variable-temperature sintering and curing in a nitrogen oven and quality detection. A diamond copper heat sink is adopted to replace a traditional CPC232 type flange during power device packaging, a nano-silver adhesive bonding process is adopted to replace a gold-tin solder eutectic process on a tube core bonding process, and a variable-temperature bonding process is adopted to optimize the structural density of nano-silver adhesive, so that the purpose of integrally reducing the thermal resistance of the device is achieved, and the reliability of the device is improved. The heat dissipation performance of the power device is optimized, the problem of heat accumulation of an active area of the power device in high-power operation is effectively solved, and the performance of an electronic device is further liberated.

The invention provides a method and device for accessing a terminal to a master station and a communication system, and belongs to the technical field of information security. The method comprises the following steps: acquiring feature information of a user through a terminal; the terminal is provided with an operator security chip and a service security chip; performing identity authentication based on the authentication request between the terminal and the master station by using the operator security chip and the cipher machine; the authentication request comprises feature information of a user and attribute information of the terminal; under the condition that the identity authentication is successful, performing service authentication based on the session negotiation request between the terminal and the master station by using the service security chip and the cipher machine; the session negotiation request comprises feature information of the service security chip and attribute information of the terminal; and under the condition that the service authentication is successful, the terminal is successfully accessed to the master station. The method and the device are used for solving the problem that in the existing scheme that the terminal accesses the master station, the master station may face the risk that remote access is attacked or abused when performing remote interaction with the terminal.