20 results about "Chip and PIN" patented technology

The application provides a manufacturing method of a power component and a power component packaging structure with high heat dissipation efficiency, and belongs to the technical field of semiconductors. The manufacturing method of the power component comprises the following steps: fixing a chip on a heat-conducting carrier plate, and connecting the chip and pins of the heat-conducting carrier plate through wires; sputtering an insulating film on the side of the heat-conducting carrier plate away from the chip; performing plastic sealing treatment on the heat-conducting carrier plate after sputtering the insulating film; and forming a heat dissipation layer on the surface of the plastic sealing body by film plating. The insulating film formed on the heat-conducting carrier plate by the sputtering method can reduce the manufacturing difficulty of the power component, improve the heat dissipation efficiency of the power component, and make the whole packaging structure smaller in size and thinner in thickness.

The invention discloses a packaging structure and a packaging method, and the packaging structure comprises a lead frame which comprises a base island for mounting a chip and a pin for electrical connection; the chip is mounted on the base island; the plurality of welding pads are positioned on the pins and the chip, and any two of the welding pads are respectively a first welding pad and a second welding pad; one end of the bonding wire is arranged on the bonding pad, the other end of the bonding wire is located above the corresponding bonding pad, and the bonding wire comprises a first bonding wire arranged on the first bonding pad and a second bonding wire arranged on the second bonding pad; and the conductive layer is arranged above the chip, and the conductive layer is electrically connected with the first bonding wire and the second bonding wire respectively. According to the invention, the overall structural strength of the electric connection circuit can be improved, and different complex packaging structures can be adapted.

The utility model discloses an integrated circuit packaging outer structure which comprises a chip and pins. The LED lamp further comprises an upper shell, a lower shell, heat dissipation fins, a positioning structure and an installation structure. The chip is located in a space defined by the upper shell and the lower shell and is fixedly connected with the upper shell; the plurality of pins are uniformly distributed on the front side and the rear side of the lower shell; a rectangular limiting shoulder is arranged on the lower shell; the plurality of radiating fins are distributed on the upper surface of the upper shell; the positioning structure comprises a plurality of positioning blocks which are evenly distributed on the front side and the rear side of the upper shell, and positioning grooves capable of containing the positioning blocks are formed in the limiting shoulders. According to the utility model, through a detachable installation structure, rapid separation of the upper shell and the lower shell is realized, so that when faults occur at the end parts of the pins and packaged internal elements, the pins and the packaged internal elements can be disassembled for detection.

This application discloses a power module and a power conversion device, relating to the field of power electronics technology. The power conversion device provided in this application includes a chip, pins, a package structure, and a circuit board. The pins are electrically connected to the chip. The package structure encloses a portion of the chip and pins. Another portion of the pins extends from the first surface of the package structure to the outside of the package structure and is electrically connected to the circuit board. The first surface of the package structure includes a protrusion for fixed connection to the circuit board. Using the design scheme provided in this application, since the package structure is fixedly connected to the circuit board, it can limit the relative displacement between the package structure and the circuit board. Therefore, when the temperature of the power conversion device changes or it is subjected to impact or vibration, the reliability of the electrical connection between the pins and the circuit board can be guaranteed, and the increase in contact resistance between the two can be avoided, thereby improving the operational stability of the power conversion device.

This invention provides a packaging method for a CIS chip, including mounting the CIS chip onto a substrate; attaching a cover plate to the photosensitive area of ​​the CIS chip; connecting the pads and pins using bonding wires; placing a mold on the substrate, with the CIS chip and pins positioned within the mold; injecting adhesive or molding compound into the mold to cover the exposed chip surface, bonding wires, and exposed CIS chip surface within the mold; removing the mold, followed by delamination and die picking to complete the packaging of the CIS chip. The substrate is flat, eliminating the support structure. The method of placing the mold on the substrate and positioning the CIS chip and pins within the mold, and injecting adhesive or molding compound into the mold to cover the exposed chip surface, bonding wires, and exposed CIS chip surface within the mold, eliminates cavities, improves overall bonding strength, and creates thinning marks at the chip surface boundaries, eliminating the need for thick-cutting and thus improving warpage.

The utility model discloses a kind of mould for SBD device packaging, it includes: template and movable insert, the template top surface is recessed and is provided with the positioning slot corresponding with movable insert, the movable insert is reversibly and symmetrically set in positioning slot, the inner wall of the movable insert of both sides and positioning slot is enclosed with the packaging cavity corresponding with SBD device, the movable insert front end bottom recess is provided with the pressure groove corresponding with the pin of SBD device, the positioning pin between the positioning slot of both sides movable insert is provided with. The mould for SBD device packaging of the utility model realizes the positioning of the chip and pin of SBD device, and improves the stability in injection molding packaging process.

The invention discloses a packaging body unitization separation method, which comprises the following steps of substrate surface mounting: laminating a plastic packaging body and then mounting the plastic packaging body on a substrate, and enabling a to-be-ground surface of the plastic packaging body to face the substrate; cutting a groove: cutting a part of the plastic package body along the direction of the cutting channel of the plastic package body to form the groove; surface grinding: after the plastic package body is turned over, the plastic package body is coated with a film and mounted on the substrate again, the to-be-ground surface of the plastic package body is horizontally ground until the pins of the plastic package body are exposed, at the moment, the bottom of the groove is ground, and unitized separation of the plastic package body is completed, and in the substrate mounting step, a chip and the pins electrically connected with the chip are packaged in the plastic package body. In the groove cutting step, the plastic package body comprises a plurality of safety areas and cutting channels, and each cutting channel is located in the corresponding safety area, the cutting sequence after original grinding is changed, the plastic package body is firstly cut to form the groove, and then the to-be-ground surface is ground, so that the problem of cutting residual glue is effectively avoided, the process is simple, and the cost is saved.

The invention provides a pin multiplexing circuit, an electronic chip, a sealing chip and a pin multiplexing method, and the pin multiplexing circuit comprises a power-on timing module which is used for starting the timing of a first time after the chip is powered on and generating an input state control signal, an input state control signal is maintained or an output state control signal is generated based on the input detection result in the first time; the input detection module is used for working under the action of the input state control signal, detecting whether an external signal is input at an output pin of the electronic chip and generating an input detection result; the output module is used for working under the action of the output state control signal and transmitting a signal to be output to an output pin; wherein the output pin is a bidirectional pin. According to the invention, the problem that the cost is increased when the ASIC chip is trimmed by adding the enabling pin in the prior art is solved.

The invention discloses a field effect transistor packaging device, and particularly relates to the technical field of field effect transistor production, the field effect transistor packaging device comprises a workbench, the top surface of the workbench is slidably connected with a placing rack, the top surface of the workbench is fixedly provided with a plurality of guide rails, and the interior of the workbench is fixedly provided with a partition plate; a plurality of dragging blocks are fixedly installed in the placing frame, a plurality of heating pipes are fixedly installed in the placing frame, and a positioning rod is fixedly installed on one side of the placing frame. Through downward pressing of the electrical testing seat, power-on testing is carried out on placed field effect transistor chips and pins, data are fed back, and the testing efficiency is improved. When it is detected that the positions of the pins and the chip electrodes are deviated, the system can automatically start the fourth pneumatic push rod and the electromagnet, and the position of the pin adjusting block is finely adjusted through the steel wire rope linkage mechanism, so that real-time quality detection and closed-loop control in the packaging process are achieved, alignment deviation can be actively corrected, and production efficiency is improved. And the packaging precision and the product yield are greatly improved.

The utility model relates to the technical field of burning equipment, in particular to a burning jig which comprises a jig seat, the top of the jig seat is respectively provided with a placing plate and a mounting frame, the top surface of the placing plate is provided with a chip groove, the inner wall of the bottom end of the chip groove is provided with a through hole, a contact mechanism is arranged between the placing plate and the jig seat, and the mounting frame is provided with a through hole. An electric sliding rail is arranged on the surface of the front side of the mounting frame, an electric sliding block is arranged in the electric sliding rail, a mounting plate is fixedly mounted on the front side of the electric sliding block, an electric push rod is arranged at the top of the mounting plate, a burner is arranged at the bottom of the mounting plate, and a burning pin is arranged at the bottom of the burner. According to the burning jig, the structural design in the contact mechanism and the arrangement of the supporting pressure spring are mainly used for applying pre-pressure to the bottom of the placing plate, flexible contact between a chip and a pin is achieved, damage to the chip caused by too large contact force is effectively avoided, and follow-up use is facilitated.

The application discloses a kind of based on fusion communication's internet of things equipment, it is related to internet of things equipment technical field, including antenna and multi-protocol fusion communication module, the antenna is accessed to multi-protocol fusion communication module by first data line, the multi-protocol fusion communication module includes: multi-protocol circuit board, multi-protocol processor, WiFi chip, LoRa chip, ZigBee chip, bluetooth chip and pin.The application is equipped with multi-protocol fusion communication module, realizes multi-protocol compatibility and dynamic adaptation, solves the problem of single protocol of traditional internet of things equipment.

This invention discloses a dual-beam laser chip welding apparatus, welding method, and chip packaging structure, relating to the field of semiconductor packaging technology. The key technical points are: it includes a laser, a beam shaping element, bonding wires, and a control module. The surface of the bonding wires is covered with an absorption layer. The laser is configured to emit a first laser beam and a second laser beam with discrete functions. The first laser beam acts on the absorption layer to generate a plasma shock wave, causing the bonding wires to undergo plastic deformation and contact the bonding points of the chip and / or packaging substrate. The second laser beam, after being processed by the beam shaping element, converts a Gaussian beam into a flat-top beam, which directly irradiates the bonding points to provide welding heat. The control module is configured to adjust the laser parameters of the laser based on received feedback signals. This invention achieves clean welding of bonding wires to chips and pins while improving welding quality and efficiency.

The invention relates to a double-sided heat dissipation power device, and the power device comprises a first AMB board which comprises a first upper copper layer, a first insulating layer and a first lower copper layer which are sequentially arranged from the top to the bottom; the second AMB plate is arranged at the lower end of the first AMB plate, the second AMB plate comprises a second upper copper layer, a second insulating layer and a second lower copper layer which are sequentially arranged from top to bottom, and a notch is formed in the upper end of the second upper copper layer; a first AMB board and a second AMB board are stacked, a chip and a pin are clamped between the first AMB board and the second AMB board, and the chip is electrically connected with the pin through upper copper areas of the first AMB board and the second AMB board, so that packaging of the chip is completed, heat generated by the chip can be transferred through a first lower copper layer, a first insulating layer and a first upper copper layer of the first AMB board in sequence, and heat transfer efficiency is improved. And heat dissipation can be carried out through the second upper copper layer, the second insulating layer and the second lower copper layer of the second AMB plate, so that a double-sided heat dissipation path is formed, and the heat dissipation efficiency is improved.

The utility model discloses a QFN packaging structure, which comprises a heat dissipation substrate, a plurality of chips, a plurality of pins, a plurality of leads and a mold sealing body, and is characterized in that the heat dissipation substrate comprises a first metal layer, a ceramic layer and a second metal layer, the first metal layer, the ceramic layer and the second metal layer are sequentially stacked, and the first metal layer comprises a plurality of base islands which are mutually spaced; the plurality of chips are connected to the sides, back to the ceramic layer, of the corresponding base islands; the plurality of pins are arranged around the heat dissipation substrate, and the pins and the heat dissipation substrate are mutually spaced; the plurality of leads are electrically connected to the corresponding chips and the pins; the molding body covers the heat dissipation substrate, the chip, the pins and the leads, and part of the surfaces of the second metal layer and the pins are exposed out of the molding body. The embodiment can simplify the process steps and improve the efficiency.

The invention provides a chip heat dissipation packaging structure, and belongs to the technical field of chip packaging, the chip heat dissipation packaging structure comprises a packaging substrate, a packaging cover plate and a chip, the bottom of the chip is provided with chip pins, and the chip heat dissipation packaging structure further comprises a positioning frame wrapping a heat dissipation assembly; a dual electrical connection path combining slot type connection with contact between the side wall of the chip and the leading-out pin is adopted, and when main connection fails, a standby path can maintain circuit conduction; upper and lower double-sided heat dissipation main channels are constructed, heat is uniformly distributed through a vapor chamber phase change material, and the heat transfer frame is matched with external airflow, so that all-directional efficient heat dissipation of the chip and the pins is realized; the condensation plate, the air bag and other assemblies form targeted heat dissipation circulation, the problem of local overheating of the pins is solved, and the temperature of the chip and key parts is effectively reduced; multiple sealing is achieved through the design of matching of the positioning boss and the clamping groove, automatic sealing of the air bag and the like, dustproof and waterproof closed-loop protection is formed, the service life of the packaging structure is prolonged, and the application requirement of a severe environment is met.

The invention provides a concatemer current sensor, which relates to the technical field of current detection, and comprises a shell, a magnetic core, an induction chip and a contact pin, a plurality of mounting grooves are formed in the shell, and the magnetic cores are fixed in the mounting grooves through pouring sealant; an air gap is formed in the magnetic core, an air gap filling block matched with the air gap is arranged in each mounting groove, a plurality of chip placing grooves are formed in the outer side of the shell, and each chip placing groove correspondingly extends into one air gap filling block; the number of the sensing chips is the same as that of the magnetic cores, and the sensing chips are arranged in the chip placing grooves in a one-to-one correspondence manner; the sensing chip comprises a chip body and a pin connected to the chip body, the chip body is placed in the chip placing groove, and the pin extends out of the chip placing groove and is connected with the contact pin; and the contact pin is fixedly arranged on the outer side of the shell. According to the invention, the influence of the stress and humidity of the pouring sealant on the sensing chip can be reduced, the production process is simple, and the production cost is low.

The utility model discloses a surface-mounted packaging voltage protector with high surge resistance and low clamping voltage, which comprises a first pin support, a second pin support, a copper jumper wire, a first chip and a second chip, and is characterized in that the first chip is stacked above the second chip through a soldering layer; the first pin support is provided with a first boss, the first boss is provided with a first channel, and the first boss is connected to the first chip through a tin soldering layer. One end of the copper jumper wire is provided with a second boss, the other end of the copper jumper wire is provided with a third boss, the second boss is provided with a second channel, the second boss is connected to the second chip through a tin soldering layer, and the third boss is connected to the second pin support through a tin soldering layer. According to the TVS / ESD chip, the channels are arranged at the welding positions between the chip and the pins and between the chip and the copper jumpers, so that the welding strength can be enhanced, the welding flux is uniform, the contact is good, the TVS / ESD chip is not easy to break, the anti-surge capability and the through-current capability of the TVS / ESD chip are improved, and the clamping voltage is reduced.

The utility model discloses a packaging carrier tape for specifying MINI-DB bridge rectifier chips, which comprises a carrier tape, first notches are uniformly arranged on the carrier tape, second notches are arranged at two ends inside the first notches, a partition layer is formed between the middle parts inside the second notches, mounting holes are arranged at the bottoms of the first notches, and the mounting holes are communicated with the first notches. A fixing mechanism is mounted in the first notch; the fixing mechanism comprises a supporting plate located in the first notch, rubber extrusion blocks are fixed to the four corners of the supporting plate, a mounting piece penetrating through the mounting hole is mounted at the bottom of the supporting plate and comprises a connecting rod, a base plate is mounted at the bottom of the connecting rod, and the rubber extrusion blocks are fixed to the rubber extrusion blocks. The outer wall of the connecting rod is fixedly sleeved with a fixing ring located in the first notch, and the outer wall of the connecting rod is sleeved with a first spring. According to the utility model, the protection on the chips and the pins can be enhanced, and accessories can be selectively installed, so that the installation of the chips of different models is realized, and the stability is kept.

The invention relates to a heat dissipation structure of a GaN power device and a preparation method, the heat dissipation structure comprises a heat sink, the heat sink is provided with an input capacitor, an output capacitor, a monolithic power chip and a pin, and the heat sink is made of diamond copper; and the single power chip is adhered to the heat sink through the nano-silver adhesive. The preparation method comprises the steps of heat sink polishing, heat sink cleaning, nano-silver adhesive temperature returning, adhesive dispensing, single power chip bonding, variable-temperature sintering and curing in a nitrogen oven and quality detection. A diamond copper heat sink is adopted to replace a traditional CPC232 type flange during power device packaging, a nano-silver adhesive bonding process is adopted to replace a gold-tin solder eutectic process on a tube core bonding process, and a variable-temperature bonding process is adopted to optimize the structural density of nano-silver adhesive, so that the purpose of integrally reducing the thermal resistance of the device is achieved, and the reliability of the device is improved. The heat dissipation performance of the power device is optimized, the problem of heat accumulation of an active area of the power device in high-power operation is effectively solved, and the performance of an electronic device is further liberated.

The invention provides a method and device for accessing a terminal to a master station and a communication system, and belongs to the technical field of information security. The method comprises the following steps: acquiring feature information of a user through a terminal; the terminal is provided with an operator security chip and a service security chip; performing identity authentication based on the authentication request between the terminal and the master station by using the operator security chip and the cipher machine; the authentication request comprises feature information of a user and attribute information of the terminal; under the condition that the identity authentication is successful, performing service authentication based on the session negotiation request between the terminal and the master station by using the service security chip and the cipher machine; the session negotiation request comprises feature information of the service security chip and attribute information of the terminal; and under the condition that the service authentication is successful, the terminal is successfully accessed to the master station. The method and the device are used for solving the problem that in the existing scheme that the terminal accesses the master station, the master station may face the risk that remote access is attacked or abused when performing remote interaction with the terminal.