Wire bonding method

A wire bonding and wire bonding technology, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve problems such as difficult to control plastic materials, failure, etc., and achieve the effect of improving the production process yield and avoiding the effect of bonding wires touching and shorting each other

Active Publication Date: 2013-10-23
NAN YA TECH
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, not only is it difficult to control the shape of the plastic material 20 coating, but also it is easy to wrap air bubbles in the plastic mat

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wire bonding method
  • Wire bonding method
  • Wire bonding method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] In order to make the purpose and features of the present invention more obvious and understandable, the specific implementation manners of the present invention will be further described below in conjunction with the accompanying drawings.

[0021] Please refer to Figure 2-4 , is a three-dimensional schematic diagram of a wire bonding method according to an embodiment of the present invention. Such as figure 2 As shown, the chip 100 is placed on the carrier 200 . The chip 100 has wire bonding pads 110 , and the carrier 200 has pins 220 . Such as image 3 As shown, the plastic material 20 is dispensed (and attached) on the chip 100 , and is located between the bonding pad 110 and the lead 220 . The plastic material 20 is a polymer material, preferably a polymer material with high viscosity and high thixotropy. Next, if Figure 4 As shown, the bonding wire 30 is bonded on the bonding pad 110 and the lead 220 , the bonding wire 30 is connected between the bonding p...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a wire bonding method which comprises the following steps: (1) placing a chip on a bearing member; (2) fixing plastic material on the chip through dispensing, wherein the plastic material is between wire bonding pads of the chip and pins of the bearing member; and (3) bonding welding wires on the wire bonding pads and the pins such that the welding wire are connected between the wire pads and the pins and are embedded in the plastic material. According to the wire bonding method provided by the invention, in a wire bonding process, the welding wires are immediately buried and fixed by the plastic material, thus welding wire collision and short circuit caused by vibration in the wire bonding process can be avoided, and the production yield can be improved.

Description

technical field [0001] The invention relates to a wire bonding method, in particular to a wire bonding method for embedding welding wires into plastic materials. Background technique [0002] With the development of electronic structures towards high capacity, high density and light weight, more functional requirements and more output / input numbers must be met in a smaller volume. When the size of the chip's bonding pad and The spacing is designed to be smaller, and the wire bonding must also choose a thinner wire. At present, the most commonly used 0.9 (mil, thousandth inch) bonding wire in the industry can no longer be used on the bonding pad of chips below 50×50 (um, micron), 0.8 (mil, thousandth inch) The following wire bonding has gradually become the mainstream of today's wire bonding process. [0003] However, small-diameter soldering wires are a big challenge for long-distance bonding. The smaller the wire diameter, the lighter and softer the welding wire is. Duri...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/60
CPCH01L2224/4824H01L2224/48465H01L2224/48471H01L2224/48479H01L2224/48991H01L2224/73265H01L2224/78301H01L2224/85051H01L2224/85186H01L2924/15311H01L24/78H01L2924/00014H01L2224/78H01L2924/181H01L2924/10161H01L2224/85H01L2924/00H01L2924/00012H01L2224/4554
Inventor 陈逸男徐文吉叶绍文刘献文
Owner NAN YA TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap