Wire bonding method
A wire bonding and wire bonding technology, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve problems such as difficult to control plastic materials, failure, etc., and achieve the effect of improving the production process yield and avoiding the effect of bonding wires touching and shorting each other
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[0020] In order to make the purpose and features of the present invention more obvious and understandable, the specific implementation manners of the present invention will be further described below in conjunction with the accompanying drawings.
[0021] Please refer to Figure 2-4 , is a three-dimensional schematic diagram of a wire bonding method according to an embodiment of the present invention. Such as figure 2 As shown, the chip 100 is placed on the carrier 200 . The chip 100 has wire bonding pads 110 , and the carrier 200 has pins 220 . Such as image 3 As shown, the plastic material 20 is dispensed (and attached) on the chip 100 , and is located between the bonding pad 110 and the lead 220 . The plastic material 20 is a polymer material, preferably a polymer material with high viscosity and high thixotropy. Next, if Figure 4 As shown, the bonding wire 30 is bonded on the bonding pad 110 and the lead 220 , the bonding wire 30 is connected between the bonding p...
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