Power module and packaging method thereof

Abstract

The invention provides a power module and a packaging method thereof. The power module comprises a bearing plate; the bearing plate comprises an insulating layer and a metal layer arranged on one surface of the insulating layer; and the power module further comprises at least one power chip and at least one driving chip, which are attached to the surface, far away from the insulating layer, of themetal layer, and are electrically connected with the metal layer through bonding wires. The power chips, the driving chips and pins are attached to the metal layer of the bearing plate, namely, a high-density lead frame and a PCB used in the prior art are replaced with the bearing plate, so that the cost is greatly reduced and the packaging process is simplified.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a power module and a packaging method thereof. Background technique [0002] Intelligent Power Module, or IPM (Intelligent Power Module), is a power drive device that combines power electronics and integrated circuit technology. Due to the advantages of high integration and high reliability, intelligent power modules are winning more and more markets, especially suitable for frequency converters and various inverter power supplies for driving motors, and are ideal for frequency control, metallurgical machinery, electric traction, servo Power electronic components commonly used in drives and frequency conversion appliances. [0003] Such as Figure 1-2 As shown, the existing intelligent power module uses a copper lead frame as the carrier, which has the following disadvantages. The power chip is welded on the lead frame. In order to reduce the module volume, even ...

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Problems solved by technology

[0003] like Figure 1-2 As shown, the existing intelligent power module uses a copper lead frame as the carrier, which has the following disadvantages. The power chip is welded on the lead frame. In order to reduce the module volume, even the embedded PCB board is used to realize the wiring of the driver IC chip, but Limited by the strength and die life of the copper lead frame, the lead frame processing cost accounts for more than half of the entire package cost

In terms of manufacturing cost and process difficulty, the stamping of lead frame is difficult and the processing cost is high. In actual production, only solder paste process can be used. After reflow soldering, flux cleaning must be carried out before wire bonding, which is easy to affect the reliability of bonding wires. have an impact

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