39results about How to "Reduce the difficulty of bonding" patented technology

The present invention provides a micro light-emitting-diode display panel and a manufacturing method thereof. The micro light-emitting-diode display panel which presses and fixes the micro light-emitting-diodes into a resin adhesive layer by filling the resin adhesive layer in the pixel groove. Meanwhile, the electrode at the bottom of the micro light-emitting-diode is guided to the top of the micro light-emitting-diode by the connection electrode, making the two electrodes of the micro light-emitting-diode are at the top, to facilitate the connection between the electrodes of the micro light-emitting-diode and the electrode points, which can reduce the difficulty of the electrode bonding of the micro light-emitting-diode, and improve the reliability of the electrode bonding of the micro light-emitting-diode.

The invention provides a surface acoustic wave resonator and a forming method thereof. The surface acoustic wave resonator is not only provided with the reflecting layer, but also provided with the cavity, so that multiple reflections of sound waves propagating in the vertical direction can be realized, the loss of sound wave energy is reduced, and the Q value of the surface acoustic wave resonator is further improved. Moreover, the reflecting layer is bonded with the bonding layer made of the same material, so that the bonding layer and the reflecting layer are bonded more easily, the bondingstrength between the bonding layer and the reflecting layer can be improved, and the structural stability of the formed surface acoustic wave resonator is correspondingly improved.

The invention provides a power module and a packaging method thereof. The power module comprises a bearing plate; the bearing plate comprises an insulating layer and a metal layer arranged on one surface of the insulating layer; and the power module further comprises at least one power chip and at least one driving chip, which are attached to the surface, far away from the insulating layer, of themetal layer, and are electrically connected with the metal layer through bonding wires. The power chips, the driving chips and pins are attached to the metal layer of the bearing plate, namely, a high-density lead frame and a PCB used in the prior art are replaced with the bearing plate, so that the cost is greatly reduced and the packaging process is simplified.

The present disclosure provides a semiconductor assembly and method of manufacturing the same. The semiconductor assembly includes a semiconductor device, a bulk semiconductor, a passivation layer, at least one conductive plug, a plurality of protective liners, and a plurality of isolation liners. The bulk semiconductor is disposed over the semiconductor device. The passivation layer covers the bulk semiconductor. The conductive plug comprises a first block disposed in the passivation layer and a second block disposed between the first block and the conductive pad, wherein portions of peripheries of the first and second blocks of the conductive plug are surrounded by the protective liners and the isolation liners.

The invention discloses a drying method for a lost foam, and the drying method comprises the following steps of: step 1, sending a coated foam mold to a coating drying room, and pre-drying the coatedfoam mold under the condition of circulating hot air, wherein the temperature of the circulating hot air is 30-35 DEG C, the wind speed is 1.5M/S-2.5M/S, the wind pressure is 0.1Pa-0.6Pa, the humidityof the drying room is 30%-35%, and the drying time is 2h-3h; step 2, sending the foam mold pre-dried in the step 1 to a stokehold drying room, and drying the foam mold under the condition of the circulating hot air, wherein the temperature of the circulating hot air is 30-50 DEG C, the wind speed is 0.5M/S-1.5M/S, the wind pressure is 0.1Pa-0.6Pa, the humidity of the drying room is 15%-20%, and the drying time is 6h-8h. The invention further discloses a preparation method for the lost foam. The invention has the organic combination of realizing the humidity, the flow of air and the temperature, prevents the saturated water vapor in the coating from being in an expanded state, and the water loss outside the coating being dried and shrunk quickly to cause the phenomenon of coating cracking.

Provided are a touch screen and a display device. The touch screen includes: thin film transistors and touch control electrodes disposed on the substrate, and the substrate includes signal channels for transmitting or receiving the touch control electrode capacitive signal in time division and control channels for controlling on and off of the thin film transistors; sources of at least two of the thin film transistors connect one signal trace to one signal channel; gates of the at least two of the thin film transistors connect one control trace to one control channel; one touch control electrode is connected to a drain of one thin film transistor.

According to the manufacturing method of the micro-display device provided by the invention, the positive or negative three-dimensional structures are prepared on a pair of wafers to be bonded respectively, the two wafers are pre-bonded under the action of alignment and pressure, and the pre-bonding process is carried out at normal temperature, so that the temperature influence is avoided, and even if a pair of heterogeneous wafers is bonded, the yield of the wafers is greatly improved. The metal plug and the metal pad are bonded by using a heating furnace after pre-bonding, and displacement caused by different thermal expansion coefficients is avoided, the sapphire substrate of the LED is peeled off by using laser after pre-bonding, and finally, the metal plug and the metal pad are bonded by using the heating furnace for heating and bonding.

The present disclosure discloses a touch OLED display panel including a flexible array substrate, a package cover and a display area; wherein a chip bonding portion and a first connection terminal are electrically connected to each other, a touch electrode and a second connection terminal are electrically connected to each other on a side of the package cover, the chip bonding portion and the first connection terminal are respectively located at two different sides outside the display area, and the first connection terminal and the second connection terminal are located at a same side outside the display area. A side of the flexible array substrate arranged with the first connection terminal is bent and connected to the package cover, and the second connection terminal and the first connection terminal are electrically connected to each other. The present disclosure further discloses a display device including the touch OLED display panel.

The invention discloses an aluminum foil with graphene for a lithium battery and a preparation method of the aluminum foil, which relate to the field of lithium battery positive electrode materials. The method comprises the following steps of immersing the aluminum foil in a corrosive agent, electrifying to corrode, putting a porous aluminum foil substrate into plasma vapor deposition equipment, vacuumizing, heating to the temperature of 980-1000 DEG C of theporous aluminum foil substrate, introducing inert gas mixed with methane to obtain a graphene aluminum foil, splashing silver ions on thesurface of the graphene aluminum foil to obtain a silver-coated graphene aluminum foil, dissolving organic lithium, organic cobalt and organic manganese in a chitin solution to obtain a reaction solution, calcining the reaction solution in an inert gas environment with the temperature of 900-1000 DEG C for 1-2 hours, and naturally cooling to obtain carbon-coated lithium, cobalt and manganese oxides. The carbon is of a porous structure, and the silver-coated graphene aluminum foil is coated with the porous carbon after the porous carbon is mixed with an adhesive. Active substances can be prevented from falling off, and the service life of the battery is prolonged.

The invention relates to the field of packaging, in particular to a novel connection device for the right-angle turn of a thick board. The problem of high difficulty in connection between a connectingdevice and the thick board in the prior art is solved mainly, and the novel connection device comprises a first angle bead connecting piece and a second angle bead connecting piece which are wrappedon the parts, close to each other, of two adjacent thick boards separately; the contact areas or the areas, close to each other, on the first angle bead connecting piece and the second angle bead connecting piece are connected through adhesive or sewing or connecting pieces, and the connection area forms a rotating shaft, so that the two thick boards are rotated along the rotating shaft separately, and the sides, located on the same side as the rotating shaft, of the first angle bead connecting piece and the second angle bead connecting piece are defined as the inner side faces; and connectingplates are connected with the inner side faces of the first angle bead connecting piece and the second angle bead connecting piece through adhesive, and first bent lines are arranged at the positions, located on the rotating shaft, of the connecting plates.

The invention discloses a self-alignment type needle seat and a use method thereof, belongs to the field of medical appliances, and is suitable for anesthetic needles, in particular to spinal anesthetic needles. The self-alignment type needle seat comprises a self-alignment type needle seat body and a needle head body installed in the self-alignment type needle seat body, and needle head injection front faces inclined in the same direction are arranged at the two ends of the needle head body; through the cooperation of the direction guiding inclined plane and the needle direction indicating port, the needle body can be effectively and autonomously aligned, an assembling worker is assisted to judge the injection front face position of the needle, the step that the assembling worker recognizes the injection front face of the needle with naked eyes is omitted, manpower input is reduced, the production cost is reduced, and the production efficiency is improved; according to the self-alignment type needle seat, the self-alignment type needle seat is simple in structure and convenient to use, the economic benefit of a medical instrument manufacturer is improved, the aligned needle head body can be fixed through cooperation of the locking and pressing embedded column and the needle locking air bag ring, the follow-up bonding difficulty of the needle head body is reduced, and the functionality of the self-alignment type needle seat is improved.