217results about How to "Precise Bonding" patented technology

This specification describes techniques for manufacturing an electronic system module. The module includes flexible multi-layer interconnection circuits with trace widths of 5 microns or less. A glass panel manufacturing facility, similar to those employed for making liquid crystal display, LCD, panels is used to fabricate the interconnection circuits. A polymer base layer is formed on a glass carrier with an intermediate release layer. Alternate layers of metal and dielectric are formed on the base layer, and patterned to create an array of multi-layer interconnection circuits on the glass panel. A thick layer of polymer is deposited on the interconnection circuit, and openings formed at input / output (I / O) pad locations. Solder paste is deposited in the openings to form wells filled with solder. After dicing the glass carrier to form separated interconnection circuits, IC chips are stud bumped and assembled using flip chip bonding, wherein the stud bumps on the components are inserted into corresponding wells on the interconnection circuits. The IC chips are tested and reworked to form tested circuit assemblies. Methods for connecting to testers and to other modules and electronic systems are described. Module packaging layers are provided for hermetic sealing and for electromagnetic shielding. A blade server embodiment is also described.

A flip chip package structure including a chip, a carrier, and a plurality of bumps is provided. The chip has a bonding surface and a plurality of bump pads thereon. The carrier is disposed corresponding to the chip and includes a substrate and a plurality of pre-solders. The substrate has a carrying surface and a patterned trace layer thereon. The patterned trace layer has a plurality of traces, and each of the traces has an outward protruding bonding portion corresponding to the bump. The line width of the bonding portion is greater than that of the trace. The pre-solders are disposed on the bonding portions, respectively. The bumps are disposed between the bump pads and the corresponding pre-solders such that the chip is electrically connected to the carrier through the bumps.

A substrate bonding apparatus for bonding substrates together in a vacuum at high speeds, with a high degree of accuracy includes a first chamber C1, a second chamber C2, and a third chamber C3. Two substrates to be bonded together are loaded in the first chamber C1. The two substrates are bonded together in the second chamber C2. The two substrates bonded together are unloaded in the third chamber C3. The first and third chambers are variably controlled from an atmospheric pressure state to a medium vacuum state. The second chamber is variably controlled from the medium vacuum state to a high vacuum state.

Provided is a method for sticking a polarizing plate to a liquid crystal panel particularly suitable for sticking the polarizing plate to the large size liquid crystal panel by mounting a polarizing plate sticking unit on a conveyance line of the liquid crystal panel, thus adopting a structure with no stage and saving space and making the structure compact as far as possible. A device for sticking the polarizing plate is constructed in such a way that a release sheet E of the polarizing plate B is released so as to expose an adhesive layer and subsequently the polarizing plate B is stuck to a substrate A while transferring the substrate A such as the liquid crystal panel along the conveyance line 2 in one direction from the carry-in side to the carry-out side.

A method for manufacturing a composite metal material combined with a nanocarbon material comprises heating a metal alloy to a half-melted state in which both liquid and solid phases are present. Next, a nongraphitized nanocarbon material is added to the half-melted metal alloy and stirred to form a composite metal material combined with a nanocarbon.

A road finisher F for producing a continuous sprayed carpet T of a bonding agent on a planum has a spraying system S on a vehicle having at least two spraying facilities 11, 11′, 14, 14′ which are located offset to each other in the and laterally to the traveling motion direction R and a control device which operates the spraying facilities using a method such that during a traveling motion of the vehicle a sprayed carpet T is produced with front and rear boundaries V, H which are continuous over the width of the sprayed carpet and which are parallel to a respective reference line L which is placed on the planum in front of the spraying facility which is the frontmost in traveling motion direction. The sprayed carpet T is produced such that each spraying facility 11, 11′, 14, 14′ first is activated or deactivated depending on the traveling motion with a predetermined distance from the or when reaching the respective reference line L.