74results about How to "Robust processing" patented technology

A method and apparatus are disclosed for using photoplethysmography to obtain physiological parameter information related to respiration rate, heart rate, heart rate variability, blood volume variability and/or the autonomic nervous system. In one implementation, the process involves obtaining (2502) a pleth, filtering (2504) the pleth to remove unwanted components, identifying (2506) a signal component of interest, monitoring (2508) blood pressure changes, monitoring (2510) heart rate, and performing (2512) an analysis of the blood pressure signal to the heart rate signal to identify a relationship associated with the component of interest. Based on this relationship, the component of interest may be identified (2514) as relating to the respiration or Mayer Wave. If it is related to the respiration wave (2516), a respiratory parameter such as breathing rate may be determined (2520). Otherwise, a Mayer Wave analysis (2518) may be performed to obtain parameter information related to the autonomic nervous system.

This specification describes techniques for fabricating connections between pairs of components. Each connection includes an array of bumps on a male component, and a matching array of wells filled with bonding material on a female component. The bump/well connections can be spaced with a pitch of less than 100 microns. One application of the invention is the attachment of electronic components to interconnection circuits or circuit assemblies to form electronic modules. The electronic components may be IC chips or high-density interconnect cables. Another application is alignment of optical components. The direct chip attachment techniques are described in the context of fabrication, assembly, test, rework, and cooling of electronic modules employing flip chip components. The preferred method is to fabricate the module on a glass carrier using a release layer so that the carrier can be removed after most of the processing is done.

Disclosed herein is a biosensor for measuring analyte in a fluid that comprises a substrate layer having disposed thereon at least one each of an electrode, cathode, anode, and a novel spacer material. The spacer material according to the present disclosure comprises a heat sealable organic layer that covers at least a portion of the anode and defines at least one edge of the anode, wherein the spacer material has at least one hole punched through it and defines a cavity or well for accepting chemistry. Also disclosed is a method of making such biosensors.

A method and apparatus for producing thin lamella for TEM observation. The steps of the method are robust and can be used to produce lamella in an automated process. In some embodiments, a protective coating have a sputtering rate matched to the sputtering rate of the work piece is deposited before forming the lamella. In some embodiments, the bottom of the lamella slopes away from the feature of interest, which keeps the lamella stable and reduces movement during thinning. In some embodiments, a fiducial is used to position the beam for the final thinning, instead of using an edge of the lamella. In some embodiments, the tabs are completed after high ion energy final thinning to keep the lamella more stable. In some embodiments, a defocused low ion energy and pattern refresh delay is used for the final cut to reduce deformation of the lamella.

The invention relates to a method for producing a ribonucleic acid (RNA) molecule composition comprising n different RNA molecule species, the method comprising a step of RNA in vitro transcription of a mixture of m different deoxyribonucleic acid (DNA) molecule species in a single reaction vessel in parallel, i.e. simultaneously, and a step of obtaining the RNA molecule composition. Also provided is the RNA composition provided by the inventive method and a pharmaceutical composition comprising the same as well as a pharmaceutical container. Moreover, the invention provides the RNA composition and the pharmaceutical composition for use as medicament.

This specification describes techniques for manufacturing an electronic system module. The module includes flexible multi-layer interconnection circuits with trace widths of 5 microns or less. A glass panel manufacturing facility, similar to those employed for making liquid crystal display, LCD, panels is used to fabricate the interconnection circuits. A polymer base layer is formed on a glass carrier with an intermediate release layer. Alternate layers of metal and dielectric are formed on the base layer, and patterned to create an array of multi-layer interconnection circuits on the glass panel. A thick layer of polymer is deposited on the interconnection circuit, and openings formed at input/output (I/O) pad locations. Solder paste is deposited in the openings to form wells filled with solder. After dicing the glass carrier to form separated interconnection circuits, IC chips are stud bumped and assembled using flip chip bonding, wherein the stud bumps on the components are inserted into corresponding wells on the interconnection circuits. The IC chips are tested and reworked to form tested circuit assemblies. Methods for connecting to testers and to other modules and electronic systems are described. Module packaging layers are provided for hermetic sealing and for electromagnetic shielding. A blade server embodiment is also described.

A diesel engine (10) operates by alternative diesel combustion. Formation of fuel and charge air mixtures is controlled by processing a particular set of values for certain input data according to a predictor algorithm model (50) to develop data values for predicted time of auto-ignition and resulting torque, and also develop data values for control of fuel and air that will produce the predicted time of auto-ignition and resulting torque. The data values developed by the predictor algorithm and data values for at least some of the input data are processed according to a control algorithm (52) that compensates for any disturbance introduced into any of the data values for at least some of the input data being processed by the control algorithm. This causes the systems to be controlled by compensated data values that produce predicted time of auto-ignition and resulting torque in the presence of any such disturbance.

The present invention relates to a process for the purification of antibodies from one or more impurities in a liquid, which process comprises contacting said liquid with a first chromatography resin comprised of a support to which multi-modal ligands have been immobilised to adsorb the antibodies to the resin, wherein each multi-modal ligand comprises at least one cation-exchanging group and at least one aromatic or heteroaromatic ring system; adding an eluent to release the antibodies from the resin; and contacting the eluate so obtained with a second chromatography resin. In one embodiment, the ring-forming atoms of the aromatic or heteroaromatic entity are selected from the group consisting of C, S and O, and the cation exchanging group is a weak cation exchanger.

A process for forming a pixel circuit is disclosed comprising: (a) providing a transparent support; (b) forming a multicolor mask having at least four different color patterns; (c) forming integrated electronic components of the pixel circuit having at least four layers of patterned functional material comprising a first conductor, a dielectric, a semiconductor, and a second conductor each layer of patterned functional material corresponding to the four different color patterns of the multicolor mask. The functional material is patterned using a photopattern corresponding to each color pattern.

A splice for connecting two segments of optical fiber cable, the splice comprising: (a) an elongated housing having a first end with a first opening, a second end with a second opening, and a central cavity, the housing being essentially seamless between the first and second ends; (b) a clamping mechanism disposed in the central cavity and comprising at least a platform defining a fiber-receiving channel open to both first and second openings, a first member adjacent to the fiber-receiving channel and having at least one cam surface, and a second member having a second cam surface, the first and second cam surfaces cooperating such that relative movement of the first and second members toward the first end causes the first member to move toward the fiber-receiving channel and an actuator to cause relative movement of the first and second members toward the first end; (c) a first buffer crimp disposed at the first opening; and (d) a second buffer crimp disposed at the second opening.

This invention provides an image processing apparatus and method, which embed a digital watermark having strong robustness against geometrical transformation/edit processes such as rotation, scaling, translation, and the like, and an image processing apparatus and method, which can accurately extract the embedded digital watermark even after the conversion/edit process such as rotation of an image or the like. A Fourier transformer (901) converts an image input from an image input unit (900) into amplitude component data, and phase component data. An envelope ring pattern generator (902) generates an embedding pattern of digital watermark information, which is expressed by a set of lines that define a circle as an envelope, on the amplitude component data. An envelope ring pattern embedding unit (903) embeds digital watermark information at predetermined positions on the line. An inverse Fourier transformer (904) computes the inverse frequency transforms of the amplitude component data embedded with the digital watermark information using the phase component data.

A first communication node (110) receives a stream of code blocks from a second communication node (120) over an acknowledged connection (131.). The first communication node processes the received code blocks in accordance with at least one transport format parameter, TFP, detects errors in received code blocks, and transmits an acknowledgment in respect of groups of code blocks indicating whether at least one error was detected in the group. A first subset of the code blocks of a group are transmitted (e.g., modulated and demodulated) in accordance with a first TFP value, and a remainder of the code blocks are transmitted in accordance with a second TFP value. Because the first and second TFP values are independent, it is possible either to shorten the necessary processing time in the first communication node or, in connection with a predictive acknowledgment mechanism, to make the receiving-side processing of code blocks that do not contribute to the value of the transmitted acknowledgment more robust.

Embodiments of the invention provide a replication and synchronization mechanism that is peer to peer and multi-threaded. Embodiments of the invention may further enable a useable alternative service in the event of a loss of communications between replicas and a fully automated recovery upon the recovery of communications between the replicas. A replication and synchronization mechanism may further provide entry level synchronization and support for transactions. The replication and synchronization mechanism merges changes that have been made independently as a result of the loss of communication between peers.

The invention provides a dependence mapping method. The method comprises the following steps of: firstly based on a bilingual language database of a source language and a target language, acquiring dependence syntactical information of a target language through dependence mapping, and establishing a dependence syntactical analysis model and a dependence syntactical analyzer of the current target language; and then based on a mapping dependence feature instance set and a supervision-free feature instance set, training the dependence syntactical model of the target language so as to obtain an optimal dependence syntactical analysis model, and constructing a final target dependence syntactic analyzer through the optimal dependence syntactical analysis model, wherein the mapping dependence feature instance set is extracted from dependence syntactical information of the target language after the dependence mapping, and the supervision-free feature instance set is extracted from a dependence tree obtained from the syntactical analysis of a target language database by the dependence syntactical analyzer of the current target language. The dependence mapping method can keep the mapping dependence information to the greatest extent, and can process noise information in a robust mode.

The present invention concerns the development of a simple, multipurpose, low cost, environmental friendly and safe binder formulation and related process, based on high volumes of alkaline activated class F fly ash residue (>760%) without ordinary Portland cement and related products, offering a wide scope of applications. More specifically, the universal binder is based on a very limited number of components (fly ash type F, Blast Furnace Slag and a mixture of alkali silicates and carbonates). The binder allows developing considerable strength at the early stage (at room temperature) and very high resistances at 28 days. The binder applies to pastes, mortars concretes and pre-cast with the same flexibility of an Ordinary Portland Cement.

The present invention relates to a process for preparation of an electrically doped semiconducting material comprising a [3]-radialene p-dopant or for preparation of an electronic device containing a layer comprising a [3]-radialene p-dopant, the process comprising the steps: (i) loading an evaporation source with the [3]-radialene p-dopant; and (ii) evaporating the [3]-radialene p-dopant at an elevated temperature and at a reduced pressure, wherein the [3]-radialene p-dopant is selected from compounds having a structure according to formula (I) wherein A¹ and A² are independently aryl- or heteroaryl-substituted cyanomethylidene groups, the aryl and/or heteroaryl is selected independently in A¹ and A² from 4-cyano-2,3,5,6-tetrafluorphenyl,2,3,5,6-tetrafluorpyridine-4-yl, 4-trifluormethyl-2,3,5,6-tetrafluorphenyl, 2,4-bis(trifluormethyl)-3,5,6-trifluorphenyl, 2,5-bis(trifluormethyl)-3,4,6-trifluorphenyl, 2,4,6-tris(trifluormethyl)-1,3-diazine-5-yl, 3,4-dicyano-2,5,6-trifluorphenyl, 2-cyano-3,5,6-trifluorpyridine-4-yl, 2-trifluormethyl-3,5,6-trifluorpyridine-4-yl, 2,5,6-trifluor-1,3-diazine-4-yl and 3-trifluormethyl-4-cyano-2,5,6-trifluophenyl), and at least one aryl or heteroaryl is 2,3,5,6-tetrafluorpirydine-4-yl, 2,4-bis(trifluormethyl)-3,5,6-trifluorphenyl, 2,5-bis(trifluormethyl)-3,4,6-trifluorphenyl, 2,4,6-tris(trifluormethyl)-1,3-diazine-5-yl, 3,4-dicyano-2,5,6-trifluorphenyl, 2-cyano-3,5,6-trifluorpyridine-4-yl, 2-trifluormethyl-3,5,6-trifluorphenyl, provided that the heteroaryl in both A¹ and A² cannot be 2,3,5,6-tetrafluorpyridine-4-yl at the same time, respective [3]-radialene compounds, and semiconducting materials and layer, and electronic devices comprising said compounds.

Prepare an oriented polymer composition that is cavitated, has cross sectional dimensions all at least three millimeters and at least one de-oriented surface layer having a thickness of at least 80 microns and at least 50 microns less than half the thickness of the oriented polymer composition, the de-oriented surface layer having a lower degree of polymer orientation than a 100 micron thick portion of the oriented polymer composition adjacent to and below the de-oriented surface layer by sufficiently heat treating a surface of a cavitated oriented polymer composition.

This specification describes techniques for manufacturing an electronic system module. The module includes flexible multi-layer interconnection circuits with trace widths as narrow as 5 microns or less. A glass panel manufacturing facility, similar to those employed for making liquid crystal display, LCD, panels is preferably used to fabricate the interconnection circuits. A multi-layer interconnection circuit is fabricated on the glass panel using a release layer. A special assembly layer is formed over the interconnection circuit comprising a thick dielectric layer with openings formed at input/output (I/O) pad locations. Solder paste is deposited in the openings using a squeegee to form wells filled with solder. IC chips are provided with gold stud bumps at I/O pad locations, and these bumps are inserted in the wells to form flip chip connections. The IC chips are tested and reworked. The same bump/well connections can be used to attach fine-pitch cables. Module packaging layers are provided for hermetic sealing and for electromagnetic shielding. A blade server or supercomputer embodiment is also described.

The invention relates to a copolymer and a substrate having a surface, at least one part of which is coated with an epilame agent comprising at least one compound in the form of a copolymer comprising V units, N units, optionally at least one M unit, and optionally at least one P unit, linked by covalent bonds by their main chains, wherein

The invention also concerns a method for coating such a substrate with epilame, said method comprising a step of checking the concentration of epilame agent in the epilame-coating bath by means of the tracer group and if necessary, a step of readjusting the concentration of epilame agent in the epilame-coating bath.