Welding platform device for semiconductor encapsulation aluminum wire or on aluminum strip bonding machine
A welding platform and semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, welding equipment, etc., can solve problems such as chip damage, reduction of the surface quality of the welded copper frame, and displacement of solder joints
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[0020] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer and clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0021] Please refer to Figure 1 to Figure 5 As shown, a welding platform device used on an aluminum wire or aluminum strip bonding machine is described below in conjunction with an embodiment, which includes a welded copper frame 1, and the bonding accessory mechanism used during welding is installed on the copper frame 1 The lower working platform 2, and the positioning pin 3 installed on the working platform 2.
[0022] The work platform 2 includes a workbench main body for supporting the copper frame 1 and restricting the copper frame 1 from moving...
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