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Welding platform device for semiconductor encapsulation aluminum wire or on aluminum strip bonding machine

A welding platform and semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, welding equipment, etc., can solve problems such as chip damage, reduction of the surface quality of the welded copper frame, and displacement of solder joints

Active Publication Date: 2017-05-24
深圳市鹏程翔实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During work, because the force direction of the fixed frame is inconsistent with the force of the welding head when welding aluminum wire or aluminum strip, the copper frame is often moved to offset the force of the welding head, resulting in the surface of the welded copper frame. Technical defects such as solder joint displacement and chip damage reduce the surface quality of the welded copper frame

Method used

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  • Welding platform device for semiconductor encapsulation aluminum wire or on aluminum strip bonding machine
  • Welding platform device for semiconductor encapsulation aluminum wire or on aluminum strip bonding machine
  • Welding platform device for semiconductor encapsulation aluminum wire or on aluminum strip bonding machine

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Embodiment Construction

[0020] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer and clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0021] Please refer to Figure 1 to Figure 5 As shown, a welding platform device used on an aluminum wire or aluminum strip bonding machine is described below in conjunction with an embodiment, which includes a welded copper frame 1, and the bonding accessory mechanism used during welding is installed on the copper frame 1 The lower working platform 2, and the positioning pin 3 installed on the working platform 2.

[0022] The work platform 2 includes a workbench main body for supporting the copper frame 1 and restricting the copper frame 1 from moving...

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PUM

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Abstract

The invention relates to a welding platform device for a semiconductor encapsulation aluminum wire or on an aluminum strip bonding machine. The welding platform device comprises a worktable main body and a plurality of locating pins, wherein a plurality of locating hole-slots are formed in the worktable main body, and the locating pins with the same number are installed in the locating hole-slots; each locating pin is fixed in the corresponding locating hole-slot after penetrating a locating traction hole in a copper frame; a pressure claw presses the copper frame when the device is in welding and bonding, a welding point carries the welded aluminum wire or aluminum strip to move to a bonding pad designated spot to perform the welding, a chip and pins on the copper frame are welded together; in the process, the copper frame is pressed on the working platform through the mutual matching of the locating pins and the locating hole-slots and the combined action of a plurality of pressure claws, so that the copper frame cannot displace when receiving an external force at different directions, the technology phenomenon in the prior art is avoided, the surface quality of the welded copper frame is improved, and the percent of pass of a product is improved.

Description

[0001] 【Technical field】 [0002] The invention relates to a welding platform device used on a semiconductor packaging aluminum wire or aluminum strip bonding machine in the semiconductor chip packaging industry. [0003] 【Background technique】 [0004] With the continuous development and progress of society, people's demand for terminal electronic products is becoming more and more popular, especially the quality and volume requirements of portable terminal electronic products are getting higher and higher. Power devices are essential components of terminal electronic products Missing components. In order to improve the quality requirements of portable electronic products and reduce the volume of the portable terminal electronic products, it is necessary to propose higher and more advanced packaging technology performance of the power device and the high performance and high precision of the power device. Require. Especially in the information technology industry and portabl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K37/00B23K37/04H01L21/67
CPCB23K37/00B23K37/04B23K2101/40H01L21/67011
Inventor 关美英关雯
Owner 深圳市鹏程翔实业有限公司
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