A welding platform device for semiconductor packaging aluminum wire or aluminum tape bonding machine

Abstract

The invention relates to a welding platform device for a semiconductor encapsulation aluminum wire or on an aluminum strip bonding machine. The welding platform device comprises a worktable main body and a plurality of locating pins, wherein a plurality of locating hole-slots are formed in the worktable main body, and the locating pins with the same number are installed in the locating hole-slots; each locating pin is fixed in the corresponding locating hole-slot after penetrating a locating traction hole in a copper frame; a pressure claw presses the copper frame when the device is in welding and bonding, a welding point carries the welded aluminum wire or aluminum strip to move to a bonding pad designated spot to perform the welding, a chip and pins on the copper frame are welded together; in the process, the copper frame is pressed on the working platform through the mutual matching of the locating pins and the locating hole-slots and the combined action of a plurality of pressure claws, so that the copper frame cannot displace when receiving an external force at different directions, the technology phenomenon in the prior art is avoided, the surface quality of the welded copper frame is improved, and the percent of pass of a product is improved.

Description

【Technical field】 [0001] The invention relates to a welding platform device used on a semiconductor packaging aluminum wire or aluminum strip bonding machine in the semiconductor chip packaging industry. 【Background technique】 [0002] With the continuous development and progress of society, people's demand for terminal electronic products is becoming more and more popular, especially the quality and volume requirements of portable terminal electronic products are getting higher and higher. Power devices are essential components of terminal electronic products Missing components. In order to improve the quality requirements of portable electronic products and reduce the volume of the portable terminal electronic products, it is necessary to propose higher and more advanced packaging technology performance of the power device and the high performance and high precision of the power device. Require. Especially in the information technology industry and portable terminal elec...

AI Technical Summary

Problems solved by technology

During work, because the force direction of the fixed frame is inconsistent with the force of the welding head when welding aluminum wire or aluminum strip, the copper frame is often moved to offset the force of the welding head, resulting in the surface of the welded copper frame. Technical defects such as solder joint displacement and chip damage reduce the surface quality of the welded copper frame

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