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Method for packaging large-power LED chip

A technology of LED chips and packaging methods, which is applied to electrical components, circuits, semiconductor devices, etc., to achieve the effects of good heat dissipation, reduced packaging costs, strong economy and practical value

Inactive Publication Date: 2013-12-18
KUNSHAN AODELU AUTOMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Purpose of the invention: In order to solve the problems caused by the prior art, the present invention provides an economical and applicable packaging method in which colloids cure high-power LED chips and brackets and have no impact on people or the environment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] A method for encapsulating a high-power LED chip of the present invention comprises the following steps:

[0016] (1) First provide LED chips, brackets, silver glue, Al wires, Al substrates and fluorescent components and colloids;

[0017] (2) Use IPA and ACE to ultrasonically clean the bracket, and use conductive compound glue to attach the high-power LED chip to the bracket. After dispensing the glue, the LED chip is stably cured; Common metals, wherein the mass fraction of iron is 60%;

[0018] (3) After baking, use Al wire to connect the high-power LED chip electrode and the guide wire of the bracket;

[0019] (4) Stir the phosphor evenly in the colloid, and at the same time cover the high-power LED chip and its pins evenly;

[0020] (5) At high temperature, the colloid is cured, and at the same time, the cured high-power LED chip and its bracket are inserted on the Al substrate.

Embodiment 2

[0021] Embodiment 2: Wherein the mass fraction content of iron in step (2) is 80%.

Embodiment 3

[0022] Embodiment 3: wherein the mass fraction content of iron in step (2) is 70%.

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Abstract

The invention discloses the chip packaging mode that a large-power LED and a support are solidified through composite iron glue. Firstly, the support is sufficiently cleaned through IPA and ACE, a backside plating reflection layer is led to a large-power LED chip process according to a DBR technology which is basically introduced in wafer factories currently, the LED chip is fixed to the support through the energy-saving and environment-friendly composite iron glue with good heat dissipation effect, after drying and solidification, electrodes of the LED chip are connected with leading wires of the support, fluorescent powder is evenly stirred in colloids, the large-power LED chip and pins of the large-power LED chip are wrapped with the fluorescent powder and the colloids, and then drying is carried out, the colloids are solidified, and the support is inserted into an aluminum substrate finally. The method is easy and feasible, saves energy and protects the environment; under the current situation that the DBR backside plating technology is basically utilized in large-power LEDs currently, because silver colloids are replaced by the composite iron glue, packaging cost and effect of metal in the collides on human bodies and the environment are reduced, and strong economical efficiency and practical value are achieved.

Description

technical field [0001] The invention relates to the field of photoelectric technology, in particular to a packaging method for high-power LED chips. Background technique [0002] LED process design includes chip design and chip packaging. At present, the packaging technology and heat dissipation technology of high-power LEDs are the hot research topics in today's society. Because the process flow of high-power LED packaging is relatively simple, but the actual process is very complicated. Moreover, LED packaging technology, especially heat dissipation technology, directly affects the service life of LEDs. Therefore, in the packaging process of high-power LEDs, silver glue is generally used to fix high-power LED chips and brackets together; however, Ag is a heavy metal, and operators must take certain protective measures during packaging, and its cost is high. Therefore, there is no package method for colloid-cured high-power LED chips that is more economical and practical...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/62
Inventor 郁彬
Owner KUNSHAN AODELU AUTOMATION TECH
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