Chip carrier holed semiconductor package element and mfg. method thereof

Abstract

A semicondcutor packaging unit with an aperture on its chip holder and its process method is to adhered a chip to a chip seat having at least one aperture to shield the back of the chip and expose the aperture, then to fully coat the back that exposes the aperture of the seat, after finishing connecting solder wire of the chip and pin and molding for forming packaging colloid wrapping the said chip and holder, the voide problem between the chip and the seat will not happen when the packaging colloid becomes solid since there is no seam in between, and no die crack or popcorn occur in the products.

Description

technical field [0001] The present invention relates to a semiconductor package, in particular to a semiconductor package with a chip seat of a lead frame as a chip carrier and an opening formed on the chip seat. Background technique [0002] A common problem with semiconductor packages that use lead frames as chip carriers is that the die pad of the lead frame has a large area, and the encapsulant used to cover the chip mounted on the die pad The adhesiveness of the semiconductor package is poor, which causes delamination between the chip base and the encapsulation compound due to temperature changes during the reliability test or actual work, which affects the reliability and quality of the semiconductor package. Moreover, the bonding area between the chip holder and the chip of this semiconductor package is relatively large, so that the chip will be subjected to the thermal stress effect from the larger chip holder under the temperature cycle in the manufacturing process,...

AI Technical Summary

Problems solved by technology

As shown in Figure 4, the chip holder 40 of the semiconductor package 4 is provided with a groove 401 near the opening 400. When the silver glue 42 is coated on the chip holder 40, the groove 401 can prevent the silver glue from being damaged by the silver glue. Excessive amount leads to the occurrence of glue overflow problem, although this can effectively prevent the silver glue 42 from overflowing into the opening 400, but when the coating amount of the silver glue 42 is insufficient, air holes will still be formed between the chip 41 and the chip holder 40 In the gap 402 that is not coated with silver glue 42, the problem of air hole formation cannot be solved

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