Locking glue array lead frame and application thereof in chip packaging piece

Abstract

The invention discloses a locking glue array lead frame and application of the locking glue array lead frame in a chip packaging piece; a plurality of locking glue holes are uniformly formed in the surface of a substrate of the lead frame, and areas, without holes, among the locking glue holes are used for lead bonding. When the lead frame is applied, the application comprises the following steps:step 1, thinning a wafer of a chip, and then pasting a DAF film on the back surface; step 2, adhering the chip to the substrate of the lead frame; step 3, cleaning a circuit to be bonded, and carrying out lead bonding between the chip and the substrate, between the chip and pins, between the substrate and the pins, or between the chips to obtain a bonded circuit; and step 4, performing plasma cleaning on the bonded circuit, performing plastic package by a plastic package material, embedding the plastic package material into plastic locking holes to form a plastic package body, curing the plastic package body, then sequentially carrying out electrotinning, laser marking and rib cutting forming to obtain a single-chip package part. The plastic package material penetrates through the plasticlocking holes, the effects of pinning strengthening and separation layer spreading preventing are achieved, and the reliability of the product is improved.

Description

technical field [0001] The invention belongs to the field of packaging and testing of semiconductor integrated circuits, in particular to a glue-locking array lead frame and its application in chip packaging. Background technique [0002] Lead frame is one of the main basic materials for integrated circuit plastic packaging production. Its substrate carries the chip, the inner pin is connected to the chip, and the chip is connected to the external circuit through the outer pin, so as to ensure smooth power supply and signal. The main body of the lead frame is made of copper, which has a good bonding ability with the plastic encapsulant, but the contact effect between the bonding wire and the copper used in the wire bonding process is not ideal, and it is necessary to perform silver plating on the appropriate area of ​​the lead frame. The bonding ability between the silver-plated layer and the plastic packaging compound is slightly smaller than that of copper, so the position...

AI Technical Summary

Problems solved by technology

The main body of the lead frame is made of copper, which has a good bonding ability with the plastic encapsulant, but the contact effect between the bonding wire and the copper used in the wire bonding process is not ideal, and silver plating is required on the appropriate area of ​​the lead frame

The bonding ability between the silver-plated layer and the plastic packaging compound is slightly smaller than that of copper, so the position of the silver-plated layer after product encapsulation is prone to serious plastic package separation defects, and it is difficult to meet the high reliability requirements of electronic packaging

[0003] At present, the lead frame has full plating (that is, the pin precision pressing area in the lead frame and the substrate are all silver-plated), single-ring plating (that is, only the pin precision pressing area in the lead frame is silver-plated), and double-ring plating (that is, the lead frame is silver-plated). Silver-plated inner pin precision pressing area, there is a silver-plated ring on the substrate) and other structures, the silver-plated layer has a large area, and there is a hidden danger of delamination

[0004] The Chinese patents with the application numbers 201711445689.9 and 201721863934.3 only open a small number of locking glue holes on the lead frame substrate where the chip is not bonded. Need to be strictly customized according to the chip, the production cost is high, the cost is high, the economic benefit is poor, and it is not conducive to the promotion and use of the product

The Chinese patent application number 201310726533.3 describes the position of the hole on the lead frame on the inner pin, the area of ​​the inner pin is small, and the impact on the separation layer is smaller than that of the substrate, and because the area of ​​the silver plating layer is only the inner lead A small part of the foot, after opening the hole, has a certain influence on the distribution of the second solder joint of the bonding wire, which reduces the applicability of the lead frame to different products

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