Manufacturing method for insulation structure of power electronic device
A technology of a power electronic device and a manufacturing method, which is applied in the field of the manufacture of an insulating structure, can solve the problems affecting the normal use of power electronic devices and the thermal conductivity of a copper substrate, and achieve the effect of increasing the thermal conductivity and ensuring the normal use.
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[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0034] The embodiment of the invention discloses a method for manufacturing an insulating structure of a power electronic device.
[0035] figure 1 It is a structural schematic diagram of an insulating structure of a power electronic device according to an embodiment of the present invention, figure 2 for figure 1 For the cross-sectional schematic diagram of A-A, see figure 1 and figure 2 , an insulating structure of a power electronic device according t...
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