High-speed film layout machine
It is a high-speed technology that can be applied to conveyor objects, electrical components, transportation and packaging, etc. It can solve problems such as low process efficiency and inability to meet high-speed chip laying requirements, and achieve the effect of improving chip laying efficiency and meeting process requirements.
Active Publication Date: 2022-04-01
科尔迅智能科技(深圳)有限公司
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Problems solved by technology
However, the existing sheet-shaped semiconductor element placement machine can only perform the actions of taking material, position correction and discharging in sequence. The entire process is inefficient and cannot meet the requirements of high-speed chip placement.
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[0030] The present invention will be described in more detail below in conjunction with the accompanying drawings and embodiments.
[0031] The invention discloses a high-speed slicer, which combines Figure 1 to Figure 13 As shown, it includes a machine case 102, and the machine body 1 is fixed inside the machine case 102. The machine table 1 is provided with a WAFER platform mechanism 2, a first visual module 3, a first pick-and-place module 4, a second Vision module 5, second pick-and-place module 6, third vision module 7, positioning module 8 and stage module 9, the WAFER stage mechanism 2, the positioning module 8 and the stage The modules 9 are arranged in sequence along the horizontal direction, wherein:
[0032] The WAFER stage mechanism 2 is used to clamp a film carrying a plurality of sheet semiconductor elements;
[0033] The first vision module 3 is arranged above the WAFER stage mechanism 2, and the first vision module 3 is used to obtain the position of the she...
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The invention discloses a high-speed slice machine, wherein: the WAFER stage mechanism is used to clamp a film carrying a plurality of sheet semiconductor elements; the first vision module is arranged above the WAFER stage mechanism, and the first vision module is used for Obtain the position of the chip semiconductor component on the WAFER stage mechanism; the first pick-and-place module is used to pick up the chip semiconductor component from the WAFER stage mechanism and place it on the positioning module; the second vision module is set on the positioning module Above the group, the second vision module is used to obtain the pose of the chip semiconductor component on the WAFER stage mechanism; the positioning module is used to correct the pose of the chip semiconductor component placed on it; the third vision module is set Above the stage module, the third vision module is used to obtain the placement position on the stage module; the second pick-and-place module is used to pick up chip semiconductor components from the positioning module and place them on the stage module position of the slice. The invention can carry out the actions of taking material and discharging material simultaneously, greatly improving the efficiency of chip arranging of the chip semiconductor element, and better meeting the technological requirement.
Description
technical field [0001] The invention relates to chip-arranging equipment for sheet-shaped semiconductor elements, in particular to a high-speed chip-arranging machine. Background technique [0002] The existing semiconductor element chip arrangement process is generally completed by a high-speed chip arrangement machine. The chip arrangement machine is used to absorb sheet semiconductor elements from the wafer tray, and then transplant and arrange them on the film according to the preset requirements for packaging or post-processing. Prepared automatic pick-and-place equipment. However, the existing sheet-shaped semiconductor element placement machines can only perform the actions of picking, position correction and discharging in sequence, and the efficiency of the entire process flow is low, which cannot meet the requirements of high-speed chip placement. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a high-...
Claims
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IPC IPC(8): H01L21/677H01L21/67
CPCH01L21/67781H01L21/67265H01L21/67766
Inventor 吴繁孙会东
Owner 科尔迅智能科技(深圳)有限公司