Auxiliary tooling for wafer arrangement

Abstract

The invention discloses an auxiliary tooling for wafer arranging machine, comprising a frame body, a telescopic rod, a rack, a spur gear, a wire take-up wheel, a pulling rope, an adjustment box, a first step motor, a mounting plate, a through slot, a second A drive seat, discharge hole, L-shaped splint, placement seat, rotating shaft, pulley, cross bar, second stepper motor, second electric push rod, first slide plate, support frame, second slide plate, first electric push rod Rod, third electric push rod, slider, vertical plate, second drive seat, driven bevel gear, driving bevel gear, U-shaped groove, second lead screw and first lead screw. In the present invention, the arrangement of the first lead screw, the U-shaped groove, the two placement seats, the support frame and the mutual cooperation between the slide plates can better place the wafer placement plates with the arranged wafers and take the wafer placement plates without wafers. At the same time, it is more efficient to operate, shortens a lot of time, and also improves the efficiency of loading and unloading.

Description

technical field [0001] The invention relates to an auxiliary tooling, in particular to an auxiliary tooling for wafer arrangement, belonging to the technical field of wafer arrangement. Background technique [0002] Quartz wafer is an important electronic material. When a quartz wafer is cut in a certain direction, an electric field or charge proportional to the stress will be generated when it is subjected to mechanical stress. This phenomenon is called the positive piezoelectric effect. When subjected to an electric field, a strain proportional to the electric field will be generated. This phenomenon is called the inverse piezoelectric effect. In the production and production of quartz wafers, the scattered quartz wafers are arranged by an arrangement device. [0003] When using the feeding device of the wafer placement plate of the existing wafer placement machine, most of the wafer placement plates need to be placed, and then the wafer placement plate without wafers shou...

AI Technical Summary

Problems solved by technology

[0003] When using the loading device of the wafer placement plate of the existing wafer placement machine, most of them need to place the arranged wafer placement board and then pick up the wafer placement board without wafers to arrange the wafers, so the operation process is more cumbersome. It takes a lot of time, and the wafer placement plate is easy to shake and cause deviation during the moving process, so that the wafer placement plate penetrates the discharge hole for sheet arranging, which greatly reduces the efficiency of sheet arranging and greatly reduces Practicality

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