Laser processing apparatus and method for adjusting laser processing apparatus

A technology of laser processing and laser beams, applied in auxiliary devices, metal processing, laser welding equipment, etc., can solve the problems of cost, expensive wave surface sensors, and labor hours for replacement operations

Pending Publication Date: 2021-09-28
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, in order to eliminate the difference in performance between devices, it is necessary to select a condensing lens having a similar shape with small individual differences, and there is a problem that not only cost but also replacement work is required.
In addition, since the wavefront sensor used to correct the shape of the spot is expensive, there is also a problem that the cost of the device becomes high.

Method used

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  • Laser processing apparatus and method for adjusting laser processing apparatus
  • Laser processing apparatus and method for adjusting laser processing apparatus
  • Laser processing apparatus and method for adjusting laser processing apparatus

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Embodiment Construction

[0025] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the constituent elements described below include substantially the same constituent elements that can be easily conceived by those skilled in the art. In addition, the structures described below can be combined appropriately. In addition, various omissions, substitutions, or changes in the configuration can be made without departing from the spirit of the present invention.

[0026] The laser processing apparatus 1 which concerns on embodiment of this invention is demonstrated based on drawing. figure 1 It is a perspective view which shows the structural example of the laser processing apparatus 1 of embodiment. figure 2 is as figure 1 A perspective view of a workpiece 100 to be processed by the laser processing apparatus 1 shown.

[0027] Such as fig...

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Abstract

The invention provides a laser processing apparatus and a method for adjusting the laser processing apparatus, which can realize low cost and suppress performance difference between apparatuses. A laser beam irradiation unit of the laser processing apparatus includes a laser oscillator; a condenser lens that condenses the laser beam emitted from the laser oscillator; and a phase modulation element disposed between the laser oscillator and the condenser lens. A voltage corresponding to a combination pattern in which a shape correction pattern for correcting the difference between the actual shape and the design value of the condenser lens and an adjustment pattern for adjusting the optical characteristics of the laser beam at the processing point are combined are applied to the phase modulation element, thereby suppressing individual differences in the condenser lens.

Description

technical field [0001] The present invention relates to a laser processing device and a method for adjusting the laser processing device. Background technique [0002] As a method for dividing a workpiece such as a semiconductor wafer, a technique is known in which a laser beam is irradiated inside the workpiece to form a modified layer as a brittle region, and an external force is applied to divide the workpiece into individual chips (see Patent Document 1). In a laser processing apparatus that irradiates a laser beam, various optical components are used to propagate a laser beam emitted from a laser oscillator, and condense it with a condenser lens to irradiate a workpiece. However, various optical distortions sometimes occur on the optical path of the laser beam, and there is a problem that processing results differ among laser processing apparatuses due to the optical distortions (a so-called performance difference between apparatuses occurs). [0003] Therefore, the a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/02B23K26/064B23K26/046B23K26/362
CPCB23K26/02B23K26/0648B23K26/046B23K26/362H01L21/78B23K26/062B23K26/0665B23K26/0853B23K26/38B23K2103/56B23K2101/40B23K26/032B23K26/082B23K26/073G02B27/0916G02B5/0891G03H1/2294G02B27/0944G02B26/0825G03H2001/0094B23K37/0461B23K37/0408B23K26/53H01L21/6836B23K26/08B23K26/0622
Inventor 植木笃木村展之
Owner DISCO CORP
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