Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Server supporting cascade connection of multiple backboards

A server and backplane technology, applied in the server field, can solve problems such as failure to meet topology requirements, poor signal quality, and low polling efficiency, and achieve the effects of solving I2C address duplication, reducing load, and improving efficiency

Active Publication Date: 2021-09-28
SHANDONG YINGXIN COMP TECH CO LTD
View PDF7 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, in this solution, the CPU VPP signal is divided into multiple signals on the motherboard and connected to the backplane through cables, which cannot meet the topology requirements and the signal quality is poor.
If the problem of signal quality is solved by adding Switch chips according to the processing method of I2C signals, each CPU needs a Switch chip, which increases the cost
In addition, in this case, when the BMC accesses the hard disk, it needs to go through the secondary Switch chip, and the polling efficiency is low.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Server supporting cascade connection of multiple backboards
  • Server supporting cascade connection of multiple backboards
  • Server supporting cascade connection of multiple backboards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] In order to make the object, technical solution and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0027] It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are to distinguish two entities with the same name but different parameters or parameters that are not the same, see "first" and "second" It is only for the convenience of expression, and should not be construed as a limitation on the embodiments of the present invention, which will not be described one by one in the subsequent embodiments.

[0028] In one example, please refer to image 3 As shown, the present invention provides a server supporting multi-backplane cascading, and the server includes:

[0029] Mainboard (abbreviated as MB), the mainboard is provided with a baseboard mana...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a server supporting cascade connection of multiple backboards. The server comprises a mainboard, the mainboard is provided with a BMC, a mainboard low-speed connector, an Expander chip and a plurality of mainboard high-speed connectors, the BMC is connected to the mainboard low-speed connector through an I2C bus, and the BMC is connected to the Expander chip through the I2C bus; a plurality of backboards, each backboard is provided with an I2C repeater, a backboard low-speed connector and a backboard high-speed connector, the backboard low-speed connector and the backboard high-speed connector are connected with the I2C repeater, the multiple backboard low-speed connectors are sequentially connected in series and then connected with the mainboard low-speed connectors, and each backboard corresponds to one mainboard high-speed connector, each backboard high-speed connector is connected with the corresponding mainboard high-speed connector and then is connected to the Expander chip; the BMC is configured to detect the in-place backboards and enable the I2C repeater of any in-place backboard, and the backboards where the enabled I2C repeaters are located serve as gated backboards. The server provided by the invention solves the problem of duplicate I2C addresses of cascaded backboards, improves the polling efficiency of the BMC accessing the backboard equipment, and reduces the load of the I2C bus.

Description

technical field [0001] The invention relates to the technical field of servers, in particular to a server supporting multi-backboard cascading. Background technique [0002] With the rapid development of cloud computing applications, informatization and intelligence have gradually covered all fields of society. People communicate more and more through the network in their daily work and life, and the amount of network data is also growing explosively. As the core equipment for processing and storing data, the server has higher and higher requirements for performance and configuration. In order to meet the complex and diverse application scenarios of different users in various fields, the configuration of the server also needs to be more flexible and changeable. For example, when a server is used in the field of large-capacity storage, more PCIe resources need to be allocated to hard disks through the backplane, while when the server is used in the computing field, only a sm...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F13/36
CPCG06F1/184G06F13/36G06F2213/0016G06F2213/0026
Inventor 冯鹏斌
Owner SHANDONG YINGXIN COMP TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products