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TVS diode packaging structure

A packaging structure and diode technology, applied in the field of diodes, can solve problems such as waste of material resources, difficulty in disassembly, and increase in cost, and achieve the effects of reducing impact, saving resources, and facilitating disassembly

Active Publication Date: 2021-09-28
SHANGHAI WEIPAN MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the above-mentioned disclosed patent is packaged by black colloid, so that the whole diode is integrated. When disassembling, the black colloid needs to be destroyed, which is difficult to disassemble. When the diode is damaged, the whole diode can only be discarded, which wastes materials. resources, cost

Method used

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  • TVS diode packaging structure
  • TVS diode packaging structure

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0022] In this embodiment, the description of the packaging structure of the TVS diode in the present invention is based on the state when the TVS diode is placed horizontally, so some words indicating orientation in this embodiment are only based on the state taken for the convenience of expression and understanding. A description method, it should be understood that the expression of this method is not a limitation to its structure.

[0023] Such as figure 1 As shown, a TVS diode packaging structure includes a plastic case 1, the upper end of the plastic case 1 has an opening, and the opening extends toward the inside of the plastic case 1 to form an installation c...

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Abstract

The invention discloses a TVS diode packaging structure which comprises a plastic shell. A TVS chip module, an upper support, a lower support, a silica gel gasket and a silica gel pressure pad are installed in the plastic shell. The silica gel gasket and the silica gel pressure pad wrap the TVS chip module. The plastic shell is further provided with a sealing cover in a matched mode, the sealing cover is detachably connected with the plastic shell, and after the sealing cover is covered, the sealing cover downwards presses the silica gel pressure pad and the silica gel gasket to tightly press the TVS chip module, the upper support and the lower support in the plastic shell for fixing, disassembly is convenient, when a diode is damaged, only a certain damaged part structure needs to be replaced, resources are saved, and cost is reduced.

Description

technical field [0001] The invention relates to the technical field of diodes, in particular to a detachable package structure of diodes. Background technique [0002] TVS diodes, also known as transient voltage suppression diodes, are high-efficiency protection devices in the form of diodes. When the two poles of the TVS diode are impacted by the reverse transient high energy, it can suddenly reduce its impedance at a very high speed (up to 10 minus 12 seconds), and at the same time absorb a large current, and the two The voltage between the terminals is clamped at a predetermined value, so as to ensure that the subsequent circuit components are not damaged by the impact of transient high energy. [0003] In the prior art, the publication number is "CN207183284U", and the invention patent titled "a TVSTVS diode packaging structure" includes upper bracket, lower bracket, chip, solder paste and black colloid. The upper bracket includes the first base island and the second ba...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L23/10H01L23/16H01L29/861
CPCH01L23/3121H01L23/10H01L23/16H01L29/861
Inventor 周伟伟欧阳炜霞高良通周懿冉邓珂杨许亮陈赵泷
Owner SHANGHAI WEIPAN MICROELECTRONICS CO LTD