Bit line structure and semiconductor memory

A bit line and contact structure technology, which is applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of insufficient induction margin and charging and discharging speed

Pending Publication Date: 2021-09-28
CHANGXIN MEMORY TECH INC
View PDF4 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a bit line structure and a semiconductor memory for the problem of insufficient sensing margin and insufficient charge and discharge speed caused by excessive contact resistance.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Bit line structure and semiconductor memory
  • Bit line structure and semiconductor memory
  • Bit line structure and semiconductor memory

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. A preferred embodiment of the invention is shown in the drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present invention will be thorough and complete.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0034] figure ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a bit line structure and a semiconductor memory. The bit line structure comprises a first bit line array and a second bit line array; the first bit line array comprises a plurality of first bit lines extending in the Y direction, and the plurality of first bit lines have the same length and are aligned in the X direction; the second bit line array comprises a plurality of second bit lines extending in the Y direction, and the plurality of second bit lines have the same length and are aligned and arranged in the X direction; the first bit line array and the second bit line array are not aligned in the X direction, and the X direction is perpendicular to the Y direction. By making the first bit line array and the second bit line array not aligned in the X direction, a larger setting space is provided for the bit line contact structure in a horizontal plane, so that the cross section area of the bit line contact structure can be enlarged, the contact resistance between the bit line contact structure and bit lines is reduced, and the induction margin and the charging and discharging speed of the device are improved.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a bit line structure and a semiconductor memory. Background technique [0002] The continuous development of science and technology has made people have higher and higher requirements for semiconductor technology, and the area of ​​semiconductor devices has been continuously reduced. Therefore, higher requirements have been put forward for the precision and accuracy of semiconductor manufacturing processes. Semiconductor memory is a kind of memory accessed by semiconductor circuits, among which Dynamic Random Access Memory (Dynamic Random Access Memory, DRAM) is widely used in various fields due to its fast storage speed and high integration. [0003] DRAM includes multiple repeated memory cells. As the size of DRAM continues to shrink and the degree of integration continues to increase, the feature size and cell area of ​​DRAM will decrease, so the area of ​​the bit line contact st...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L23/538H01L27/108H01L21/8242
CPCH01L23/5386H10B12/30H10B12/485H10B12/482
Inventor 刘志拯
Owner CHANGXIN MEMORY TECH INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products