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LED chip non-contact detection device and method

A technology of LED chips and detection devices, which is applied in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve the problem of insufficient detection signals of LED chips, and achieve the effect of prolonging the service life and improving the reliability of use

Pending Publication Date: 2021-10-01
FUZHOU UNIVERSITY +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] It can realize the synchronous acquisition of the electrical signal and optical signal of a single LED chip in a non-contact manner, which can overcome the shortcomings of physical damage to the LED chip or insufficient detection signals in the traditional detection method

Method used

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  • LED chip non-contact detection device and method
  • LED chip non-contact detection device and method
  • LED chip non-contact detection device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] In the present embodiment, the first substrate is 80% in the light transmittance of the light-emitting wavelength range of the detected LED chip.

[0048] In the present embodiment, the first substrate and the first conductive layer have a size of 2 μm × 2 μm, and is not larger than the size of the detected LED chip.

[0049] In the present embodiment, the vertical distance of the first conductive layer and the detected LED chip is 10 μm.

[0050] In the present embodiment, the second conductive layer is located in the lower surface of the second substrate.

[0051] In the present embodiment, the voltage waveform output from the power supply system includes a sine wave, a magnitude of 30 V, and a frequency of 3 MHz.

[0052] In the present embodiment, the optical signal detection system is a brightness detector and a light lens group.

[0053] In the present embodiment, the electrical signal detection system is a current analyzer.

[0054] In the present embodiment, the opt...

Embodiment 2

[0062] In the present embodiment, the first substrate and the optical signal detection system move, the second substrate, the second conductive layer, and the LED chip array are fixed.

[0063] Image 6 For the first substrate and the optical signal detection system, the first substrate, the second conductive layer, the LED chip array is fixed integral motion process. The first substrate 101 is disposed on the surface of the first conductive layer 102, the first conductive layer 102 on the surface of the barrier layer 103; the LED chip 203 to be detected is disposed on the surface of the second substrate 201, and the second substrate 201 is located on the surface of the second conductive layer 202; The optical signal detection system 301 is disposed above the first substrate 101 for recording the light emitting information of the detected LED chip 203; and is fixed by the second substrate 201, the second conductive layer 202, the LED chip array 203, first The substrate 101, the fi...

Embodiment 3

[0065] In the present embodiment, the second conductive layer can be on the upper surface of the second substrate. The electrical signal output from the power supply system is applied to the first conductive layer, the second conductive layer ground.

[0066] Figure 7 A cross-sectional configuration diagram disposed above the second substrate for Example Three-second conductive layers. The first substrate 101 is disposed on the surface of the first conductive layer 102, the first conductive layer 102 is surfaced on the surface of the barrier layer 103; the LED chip 203 to be detected is disposed on the surface of the second conductive layer 202, and the second conductive layer 202 is located on the second substrate 201 surface. The optical signal detecting system 301 is disposed above the first substrate 101 for recording the light emission information of the detected LED chip 203; the power supply system 401 applies an electric signal between the first conductive layer 102 and t...

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Abstract

The invention provides an LED chip non-contact detection device and method. The LED chip non-contact detection device comprises a first substrate with a first conductive plate, a second substrate with a second conductive plate, a displacement device, an optical signal detection system, an electric signal detection system and a power supply system. The size of the first substrate is not greater than that of an LED chip to be tested, and the first substrate is not in contact with the LED chip to be tested; the second substrate is used for bearing the LED chip to be tested; the displacement device is used for controlling the relative position of the first substrate and the second substrate; the light signal detection system is used for detecting light emitting information of the LED chip; the electric signal detection system is used for detecting an electric signal of the LED chip; and the power supply system is connected with the first conductive plate and the second conductive plate. Only one LED chip is detected each time, electric signals and optical signals of the single LED chip can be collected at the same time, damage of a probe to the LED chip in the traditional LED chip detection process is avoided, the use reliability of the detection chip is improved, and the actual service life of the LED chip is prolonged.

Description

Technical field [0001] The present invention belongs to the field of displaying light-emitting device detection, and more particularly to a contactless detection device and method for an LED chip. Background technique [0002] As a transformed display technology, LED has been confirmed to have high efficiency, small, long life, high definition and reaction time, so that the reaction time is high, and therefore in display, medical care, lighting and traffic indication. There are many aspects of the lamp to be widely used and accepted by the public. [0003] Micro LEDs are one of the important branches of LED technology, which inherits the most advantages of LEDs, and also has LED unparalleled advantages in contrast, saturation, and response efficiency, and has been subject to experts and technologies worldwide. Personal attention. However, the traditional method is to contact each micro LED chip of the LED chip array, which inevitably causes damage to the LED chip. China Patent (2...

Claims

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Application Information

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IPC IPC(8): H01L21/66
CPCH01L22/12H01L22/14H01L22/20
Inventor 吴朝兴陈荣郭太良张永爱周雄图王堃刘晔
Owner FUZHOU UNIVERSITY