Equalization mechanism and glue removing device

Abstract

The invention relates to an equipartition mechanism and a glue removing device, the equipartition mechanism and the glue removing device are used for dispersing silicon wafers, and the equipartition mechanism comprises a spraying pipe and a second liquid pump. And a plurality of spraying holes which are uniformly distributed at intervals are formed in the spraying pipe in the length direction. And the second liquid pump is connected with the spraying pipe through a pipeline, can convey liquid into the spraying pipe and enables the liquid to be sprayed from the spraying holes to the adjacent silicon wafers. When the liquid is sprayed out from the spraying holes, certain impact force is generated, and when the liquid is sprayed into gaps between the adjacent silicon wafers, the silicon wafers which are originally tightly attached together can be scattered. And the spraying holes are uniformly distributed on the spraying pipe, so that the gaps among different silicon wafers are impacted by the same liquid, and new gaps among the different silicon wafers are also the same, namely, the silicon wafers are uniformly dispersed under the impact of the liquid.

Description

technical field [0001] The invention relates to the technical field of silicon wafer manufacturing, in particular to an equalizing mechanism and a degumming device. Background technique [0002] After soaking in water, the silicon wafers will gather into different silicon wafer stacks. The gaps between the silicon wafers inside the silicon wafer stacks are small, and the gaps between different silicon wafer stacks are large, that is, the gaps between individual silicon wafers are not the same , thus affecting the subsequent insertion operation of the silicon wafer. Contents of the invention [0003] In view of this, it is necessary to provide an equalizing mechanism and a degumming device to solve the problem that the gap between individual silicon wafers is not the same, thereby affecting the subsequent insertion operation of the silicon wafers. [0004] The invention provides an evenly distributing mechanism for dispersing silicon wafers. The evenly distributing mechani...

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Problems solved by technology

[0003] In view of this, it is necessary to provide an equalizing mechanism and a degumming device to solve the problem that the gap between individual silicon wafers is not the same, thereby affecting the subsequent insertion operation of silicon wafers

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