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Double-sided thinning method for wafer

A wafer and double-sided technology, applied in the direction of grinding equipment, grinding machine tools, metal processing equipment, etc., can solve the problems of insufficient wafer processing and processing effects to be improved, so as to improve the grinding thinning efficiency and fine processing precision , Improve the effect of grinding fineness

Inactive Publication Date: 2021-10-15
SAE TECH DELEVOPMENT DONGGUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The existing way of thinning the wafer does not process the wafer finely enough, and the processing effect needs to be improved

Method used

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  • Double-sided thinning method for wafer

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] See figure 1 , an embodiment of the present invention provides a method for thinning both sides of a wafer, including:

[0023] S10, coating the protective glue on the front side of the wafer, and exposing the back side of the wafer;

[0024] S11, roughly grinding the wafer with an alkaline grinding liquid containing the first grinding powder through a grinding device;

[0025] S12, cleaning the wafer;

[0026] S13, finely grinding the wafer with an ...

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Abstract

The invention discloses a double-sided thinning method for a wafer. The method comprises the following steps: coating the front surface of the wafer with protection glue, and enabling the back surface of the wafer to be exposed; performing coarse grinding on the wafer by using an alkaline grinding liquid containing first grinding powder through a grinding device; washing the wafer; performing fine grinding on the wafer by using an alkaline grinding liquid containing second grinding powder through the grinding device; washing the wafer, and removing the protection glue on the front surface of the wafer; and putting the wafer into a grinding machine, and performing fine grinding on the front surface and the back surface of the wafer by using third grinding powder, wherein the diameter of the third grinding powder is smaller than or equal to that of the second grinding powder, and the diameter of the second grinding powder is smaller than that of the first grinding powder. With the double-sided thinning method for the wafer, the processing fineness of wafer thinning can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a double-sided thinning method of a wafer. Background technique [0002] Wafer refers to the substrate (also called substrate) on which semiconductor transistors or integrated circuits are manufactured. With the continuous development of semiconductor chips towards high density, high performance, miniaturization and thinning, the thinning process of semiconductor wafers becomes more and more important. At present, the wafer is generally thinned by mechanical grinding, and double-sided grinding is generally used. The process is that the upper and lower large plates can move independently, and the wafer is sandwiched in the middle, and both sides of the wafer are ground at the same time. The existing way of thinning the wafer does not process the wafer finely enough, and the processing effect needs to be improved. Contents of the invention [0003] In view of the above p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/00B24B37/00
CPCB24B1/00B24B37/00
Inventor 刘尖华
Owner SAE TECH DELEVOPMENT DONGGUAN
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