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A cooling platform with a special channel design of alloy material

A technology of alloy materials and heat sinks, which is applied in the field of diamond, can solve the problems of poor heat sink effect and meet the requirements of heat sinks, and achieve the effect of easy inner surface area, wide temperature control range, and reduced inhomogeneity

Active Publication Date: 2021-12-21
SHANGHAI BOSHIGUANG SEMICON TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the process of existing diamond growth, the cooling table cannot meet the requirements under high-power working conditions, and the effect of the cooling table is not good.

Method used

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  • A cooling platform with a special channel design of alloy material
  • A cooling platform with a special channel design of alloy material
  • A cooling platform with a special channel design of alloy material

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Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0017] refer to Figure 1-2 , a cooling platform designed for a special channel of an alloy material, comprising: a sample placement platform 1, a graphene heating structure 2 set in conflict with the sample placement platform 1, and a heat dissipation set set in conflict with the graphene heating structure 2 Structure 3 and a protective cover 4 for wrapping the heat dissipation structure 3; the heat dissipation structure 3 includes a heat dissipation platform...

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Abstract

The invention discloses a cooling table with a special channel design of alloy materials, comprising: a sample placement table, a graphene heating structure contradicting the sample placement table, and a heat dissipation structure contradicting the graphene heating structure And a protective cover for wrapping the heat dissipation structure; the heat dissipation structure includes a heat dissipation platform that conflicts with the graphene heating structure and a heat dissipation pipeline that is communicated with the heat dissipation platform, and the middle part of the heat dissipation platform is provided with a water pipe channel, A heat dissipation pipe is embedded in the water pipe channel; a plurality of waterway annular grooves are opened inside the heat dissipation platform, and the waterway annular groove communicates with the water pipe channel. According to the present invention, the heat dissipation requirement of diamond under high power conditions can be met, and the cost is not high.

Description

technical field [0001] The invention relates to the technical field of diamonds, in particular to a cooling platform with a special channel design of an alloy material. Background technique [0002] Diamond film has become a new functional material in the 21st century due to its superior performance. Since the early 1980s, it has been widely valued by countries all over the world, because the diamond film has a series of excellent properties that are very close to diamonds in nature, with the highest hardness, high elastic modulus, extremely low coefficient of friction, and extremely high thermal conductivity. Conductivity, high room temperature resistivity, excellent insulation performance, high electron and hole transfer rate, and transparent in a wide range of light bands, with a high band gap, becoming a new generation of Functional semiconductor material; at the same time, it also has excellent acid and alkali resistance, and corrosion resistance is a very good corrosi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/02
CPCC22C9/02Y02B30/00F28F21/085
Inventor 胡常青赵建海
Owner SHANGHAI BOSHIGUANG SEMICON TECH CO LTD