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Thermal stress eliminating device for liquid lead bismuth alloy conveying pipeline

A liquid lead-bismuth alloy and transportation pipeline technology, which is applied in expansion compensation devices for pipelines, pipe components, pipes/pipe joints/fittings, etc., can solve problems such as the inability to meet the needs of liquid lead-bismuth alloy transportation, and achieve heat reduction Dissipation, elimination of high temperature stress, and reduction of axial thermal deformation

Active Publication Date: 2021-10-19
SHENZHEN UNIV
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Problems solved by technology

[0007] The inventor found that the pipeline stress relief device in the prior art cannot meet the needs of liquid lead-bismuth alloy transportation

Method used

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  • Thermal stress eliminating device for liquid lead bismuth alloy conveying pipeline
  • Thermal stress eliminating device for liquid lead bismuth alloy conveying pipeline

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Embodiment Construction

[0032] In order to make the object, technical solution and advantages of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0033] Based on the problems existing in the prior art, this embodiment provides a thermal stress relief device for liquid lead-bismuth alloy delivery pipeline, specifically as figure 1 and figure 2 As shown, the thermal stress relief device for liquid lead-bismuth alloy delivery pipeline in this embodiment includes an inner pipeline 100 and an outer pipeline 300, the inner pipeline 100 is arranged in the outer pipeline 300, and the inner pipeline 100 and the outer pipeline 300 A gap space 800 is formed between the pipes 300; the outer pipe 300 includes a first connecting pipe 310, a b...

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Abstract

The invention discloses a thermal stress eliminating device for a liquid lead bismuth alloy conveying pipeline. The device comprises an inner pipeline and an outer pipeline, wherein the inner pipeline is arranged in the outer pipeline, and a clearance space is formed between the inner pipeline and the outer pipeline. Axial thermal deformation of the inner pipeline can be compensated, high-temperature stress of the inner pipeline is eliminated, and axial thermal deformation of the first connecting pipe and the second connecting pipe can be compensated through elastic deformation of the corrugated pipe; the clearance space formed between the inner pipeline and the outer pipeline can prevent heat of the inner pipeline from being conducted to the first connecting pipe and the second connecting pipe to a certain extent. On one hand, loss of heat of the liquid lead bismuth alloy in the inner pipeline can be reduced, and on the other hand, the temperature of the first connecting pipe and the second connecting pipe can be reduced. Therefore, the axial thermal deformation of the first connecting pipe and the second connecting pipe is reduced.

Description

technical field [0001] The invention relates to the technical field of nuclear science and engineering, in particular to a thermal stress relief device for a liquid lead-bismuth alloy delivery pipeline. Background technique [0002] Nuclear energy is an important part of my country's large-scale clean energy. Traditional commercial light water reactors use high-pressure water as the reactor core coolant. When the main pipeline of the primary circuit leaks or ruptures, part of the high-pressure water will enter the low-pressure atmosphere and flash If the water replenishment rate of the coolant is lower than the leakage rate, the reactor core may be exposed, and even serious accidents such as core melting may occur. Therefore, improving reactor safety is the consistent pursuit of nuclear energy technology development. [0003] Lead-bismuth alloy has a low melting point, high boiling point, excellent neutron economy, good thermal properties, and high chemical stability. It can ...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16L51/02
CPCF16L51/02F16L51/022
Inventor 邓阳斌殷园
Owner SHENZHEN UNIV
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