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Substrate processing apparatus

A technology of a substrate processing device and an exhaust device, which can be applied to spray devices, spray devices, single handheld devices, etc., can solve problems such as reducing the overall process output and reducing the reliability of the substrate processing device.

Pending Publication Date: 2021-10-22
WONIK IPS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The above-mentioned tubes can be damaged due to the large difference between the internal temperature and pressure and the external temperature and pressure due to the material characteristics. The damage of this tube reduces the reliability of the substrate processing device itself, and also serves as a reason for reducing the overall process yield. Have an effect

Method used

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Embodiment Construction

[0055] Hereinafter, the substrate processing apparatus of the present invention will be described with reference to the accompanying drawings.

[0056] Such as figure 1 As shown, the substrate processing apparatus of the present invention includes: an outer tube 20, forming a protective space 22 inside, and forming a first inlet at the lower part; an inner tube 30, forming a reaction space 32 inside, and forming a second inlet at the lower part, and A part is accommodated in the outer tube 20, and the part forming the second inlet protrudes downward of the outer tube 20; a manifold assembly supports the upper outer tube 20 and the lower inner tube 30 at intervals; Cover flange 70, seals the lower portion of the manifold assembly.

[0057] The present invention exemplifies a substrate processing apparatus that performs a process for processing a substrate.

[0058] As the process for processing a substrate performed by the substrate processing apparatus, a process for forming...

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Abstract

The present invention relates to a substrate processing apparatus, and more particularly, the substrate processing apparatus includes a gas utility exhausting each of the reaction space and the protective space so that a pressure change process including a high-pressure process, which is in a state of a pressure higher than atmospheric pressure, and a low-pressure process that is in a state of a pressure lower than the atmospheric pressure, is performed on a plurality of substrates introduced into the reaction space.

Description

technical field [0001] The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus that performs substrate processing by high pressure and low pressure. Background technique [0002] The substrate processing apparatus is a process for processing a substrate such as a wafer, and a reactor (Reactor) using a wafer boat can be used for heat treatment of the substrate. [0003] The reactor is configured such that a boat loaded with substrates in units of a predetermined number rises in a loading area to perform heat treatment, or descends toward the loading area to unload heat-treated substrates. [0004] At this time, the reactor has a tube that forms a reaction space that accommodates the raised boat and is isolated from the outside, and generally, the tube is formed of a quartz material having good heat transfer characteristics to efficiently perform a heat treatment process. [0005] In view of the above-menti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67098H01L21/67017H01L21/67248H01L21/67103H01L21/67757C23C16/34C23C16/4412C23C16/455H01L21/67303C23C16/4584B05B1/323B05B11/0037B05B11/0039
Inventor 李承燮孙贞琳金周浩朴坰金周燮金颍俊金丙祚
Owner WONIK IPS CO LTD