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Gluing equipment

A technology for pasting glue and equipment, which is applied in the direction of electrical components, printed circuit manufacturing, and electrical component assembly of printed circuits. It can solve the problems of gold finger oxidation, high labor intensity, and low production efficiency, so as to improve production efficiency and reduce labor Strength, effect of reducing the risk of foreign matter contamination

Active Publication Date: 2021-10-22
深圳市特瑞吉科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, this process is all done manually off-line. Manual handling, assembly, and glue application are prone to foreign matter or hand sweat contaminating the gold fingers, resulting in oxidation of the gold fingers, and the labor intensity is high and the production efficiency is low.

Method used

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Embodiment Construction

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0041] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the figure). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0042] In the present invention, unless...

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PUM

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Abstract

The invention provides gluing equipment, which comprises a rack, a material picking device and a gluing device, wherein a workbench is arranged on the rack, a bottom plate storage station, a circuit board storage station and a gluing station are formed on the workbench, the material picking device is arranged on the workbench so as to sequentially pick up bottom plates and circuit boards from the bottom plate storage station and the circuit board storage station and place the bottom plates and the circuit boards on the gluing station in a stacked mode, and the gluing device is arranged on the workbench and is used for pasting an adhesive tape on the bottom plate and the circuit board in the gluing station and slitting the adhesive tape. According to the technical scheme, the foreign matter contamination risk in the gluing process is reduced, the labor intensity is reduced, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the field of patch technology, in particular to a glue sticking device. Background technique [0002] Before surface-mounting the printed circuit board, it is necessary to place the printed circuit board on the bottom plate of the jig, and then paste the high-temperature tape to fix the printed circuit board and protect the gold fingers on the printed circuit board. However, at present, this process is all done manually off-line. Manual handling, assembly, and glue application are prone to foreign matter or hand sweat contaminating the gold finger and causing oxidation of the gold finger. The labor intensity is high and the production efficiency is low. Contents of the invention [0003] The main purpose of the present invention is to provide a gluing equipment, which aims to reduce the risk of foreign matter contamination during the gluing process, reduce labor intensity and improve production efficiency. [0004] In order ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/30
CPCH05K3/00H05K3/303
Inventor 张箭宇
Owner 深圳市特瑞吉科技有限公司
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