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Drying system for semiconductor wafer and working method thereof

A drying system and semiconductor technology, applied in the direction of drying solid materials, drying chamber/container, drying gas arrangement, etc., can solve the problems of high cost and unsatisfactory drying effect of semiconductor wafers, achieve low cost, improve drying effect, and structure simple effect

Pending Publication Date: 2021-10-29
常州市恒迈干燥设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] Traditional drying equipment dries semiconductor wafers through long transportation lines, which is not only expensive but also unsatisfactory for semiconductor wafers

Method used

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  • Drying system for semiconductor wafer and working method thereof
  • Drying system for semiconductor wafer and working method thereof
  • Drying system for semiconductor wafer and working method thereof

Examples

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Effect test

Embodiment 1

[0037] In this example, if Figure 1 to Figure 6 As shown, the present embodiment provides a drying system for semiconductor wafers, which includes: an inclined feeding plate 1, a feeding disc device 2, a drying device 3, a blocking device 4 and a conveying device 5; wherein the The feed plate 1 and the drying device 3 are located above the feed disc device 2, the material blocking device 4 is attached to the upper surface of the feed disc device 2, and the conveying device 5 is located on the feed disc device 2. below; the feeding plate 1 is suitable for putting semiconductor wafers into the feeding disc device 2, so that the corresponding semiconductor wafers are embedded in the rotating feeding disc device 2; the drying device 3 is suitable for To dry the semiconductor wafer on the feeding plate 1 and the feeding disc device 2; the feeding disc device 2 is suitable for driving the embedded semiconductor wafer to rotate to a corresponding position to fall onto the conveying ...

Embodiment 2

[0068]On the basis of embodiment 1, the present invention provides a kind of working method that adopts the drying system for semiconductor wafers as provided in embodiment 1, which includes: feeding plate 1, feeding disc device 2, drying device 3 , the blocking device 4, and the conveying device 5 are arranged obliquely; the semiconductor wafer is put into the feeding disc device 2 through the feeding plate 1, so that the corresponding semiconductor wafer is embedded in the rotating feeding disc device 2; The semiconductor wafer on the feeding plate 1 and the feeding disc device 2 is dried by the drying device 3; the embedded semiconductor wafer is driven by the feeding disc device 2 to rotate to the corresponding position to fall on the conveying device 5; The blocking device 4 stops the semiconductor wafer exposed on the upper disk surface from rotating with the feeding disk device 2, and makes the semiconductor wafer exposed on the upper disk surface embedded in the rotatin...

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Abstract

The invention belongs to the technical field of semiconductor drying equipment, and particularly relates to a drying system for a semiconductor wafer and a working method thereof. The drying system for the semiconductor wafer comprises a feeding plate, a feeding disc device, a drying device, a material blocking device and a conveying device; wherein the feeding plate puts the semiconductor wafer into the feeding disc device; the feeding disc device drives the embedded semiconductor wafer to rotate to a corresponding position so as to fall onto the conveying device; and the material blocking device prevents the portion, exposed on the upper disc surface, of the semiconductor wafer from rotating along with the feeding disc device and enables the portion, exposed on the upper disc surface of the semiconductor wafer to be embedded into the rotating feeding disc device. According to the drying system, the feeding plate and the feeding disc device are arranged to disperse semiconductor wafers, the semiconductor wafers are dried by the drying device, the drying effect is good, the structure is simple, the manufacturing cost is low, meanwhile, the semiconductor wafers are subjected to dust removal through the material blocking device, and the whole semiconductor wafers are continuously turned over to be dried.

Description

technical field [0001] The invention belongs to the technical field of semiconductor drying equipment, and in particular relates to a drying system for semiconductor wafers and a working method thereof. Background technique [0002] Traditional drying equipment dries semiconductor wafers through long transportation lines, which is not only expensive but also unsatisfactory for semiconductor wafers. [0003] Therefore, there is an urgent need to develop a new drying system for semiconductor wafers and its working method to solve the above problems. Contents of the invention [0004] The object of the present invention is to provide a drying system for semiconductor wafers and its working method. [0005] In order to solve the above-mentioned technical problems, the present invention provides a drying system for semiconductor wafers, which includes: an inclined feeding plate, a feeding disc device, a drying device, a material blocking device and a conveying device; wherein ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F26B11/18F26B21/00F26B25/04F26B25/18
CPCF26B11/184F26B21/001F26B21/004F26B25/04F26B25/18
Inventor 张祖华
Owner 常州市恒迈干燥设备有限公司
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