Unlock instant, AI-driven research and patent intelligence for your innovation.

Substrate processing apparatus, stage, and temperature control method

A technology of a substrate processing device and a temperature control method, applied to positioning devices, holding devices applying electrostatic attraction, manufacturing tools, etc., capable of solving problems such as warping of mounting tables

Pending Publication Date: 2021-11-02
TOKYO ELECTRON LTD
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, it is known that the mounting table undergoes deformation such as warping due to thermal stress (for example, refer to Patent Document 2).

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate processing apparatus, stage, and temperature control method
  • Substrate processing apparatus, stage, and temperature control method
  • Substrate processing apparatus, stage, and temperature control method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] Hereinafter, modes for implementing the present disclosure will be described with reference to the drawings. In each drawing, the same reference numerals are attached to the same components, and overlapping descriptions may be omitted.

[0023] [Substrate Processing Equipment]

[0024] First, refer to figure 1 An example of the substrate processing apparatus according to the embodiment will be described. figure 1 It is a figure which shows an example of the substrate processing apparatus concerning embodiment. The substrate processing apparatus 1 is a capacitive coupling type apparatus.

[0025] The substrate processing apparatus 1 has a chamber 10 . Inside the chamber 10 is provided an inner space 10s. Chamber 10 includes a chamber body 12 . The chamber main body 12 has a substantially cylindrical shape. An internal space 10s is provided inside the chamber main body 12 . The chamber main body 12 is formed of aluminum, for example. A corrosion-resistant film is...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a substrate processing apparatus, a stage, and a temperature control method to control the deformation of the stage. The substrate processing apparatus includes a stage on which a substrate is placed, wherein the stage includes a first plate, a first temperature adjustment mechanism configured to control a temperature of the first plate, a second plate provided below the first plate, a second temperature adjustment mechanism configured to control a temperature of the second plate, and a fastening member configured to fasten the first plate and the second plate.

Description

technical field [0001] The disclosure relates to a substrate processing device, a mounting table and a temperature control method. Background technique [0002] It is known that substrates are deformed due to processes such as warping (for example, refer to Patent Document 1). In addition, it is known that the mounting table undergoes deformation such as warping due to thermal stress (for example, refer to Patent Document 2). [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent Laid-Open No. 2005-72286 [0006] Patent Document 2: Japanese Patent Laid-Open No. 2000-21962 Contents of the invention [0007] The problem to be solved by the invention [0008] The present disclosure provides a technique capable of controlling deformation of a mounting table. [0009] solutions to problems [0010] According to one aspect of the present disclosure, there is provided a substrate processing apparatus having a mounting table for ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32
CPCH01J37/32724H01L21/6831H01L21/67248H01L21/67109H01L21/68785H01L21/6833H02N13/00B23Q3/15H01L21/67288C23C16/4586C23C16/46F28F27/00
Inventor 齐藤秀翔
Owner TOKYO ELECTRON LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com