A light emitting diode and its manufacturing method
A technology for light-emitting diodes and control panels, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of reducing the service life of light-emitting diodes and poor heat dissipation effect.
Active Publication Date: 2021-12-03
南通宝恒工贸有限公司
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- Claims
- Application Information
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Problems solved by technology
[0002] After the light-emitting diodes in the prior art are produced, the epoxy resin cap directly wraps the chip unit, and the lead rod is drawn out from the epoxy resin cap. This assembly method has the problem of poor heat dissipation, thereby reducing the service life of the entire light-emitting diode
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[0034] In order to better explain the present invention and facilitate understanding, the present invention will be described in detail below through specific embodiments in conjunction with the accompanying drawings.
[0035] A light emitting diode according to an embodiment of the present invention, such as figure 1 , figure 2 As shown, it includes a chip unit 1, a lead rod 2 and an epoxy resin cap 3, the chip unit 1 is fixedly connected with a lead rod 2, the chip unit 1 is arranged in the epoxy resin cap 3, and the lead rod 2 is fixedly connected with a control panel 4. The lead rod 2 runs through the control panel 4, and the control panel 4 is blocked at the opening end of the epoxy resin cap 3. The chip unit 1 is set in the plate groove opened on the epoxy resin cap 3. The control panel 4 is provided with two A symmetrically distributed through square hole, the through square hole of the control panel 4 is provided with a control assembly 5, the two sides of the contro...
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The invention relates to the technical field of light emitting diodes, in particular to a light emitting diode, comprising a chip unit, a lead rod and an epoxy resin cap, the chip unit is fixedly connected with a lead rod, the chip unit is arranged in the epoxy resin cap, and the lead rod is fixed on the The control panel is connected, the lead rod runs through the control panel, the control panel is blocked at the opening end of the epoxy resin cap, and the chip unit is arranged in the plate groove opened on the epoxy resin cap. The invention realizes the high temperature inside the epoxy resin cap. environment, the control panel will move away from the epoxy resin cap, so that the heat inside the epoxy resin cap can be discharged outside, and after the chip unit is no longer working, the control panel will re-seal the epoxy resin cap, so as to prevent external dust from falling into the In the epoxy resin cap, this protects the chip unit to a certain extent and realizes the effect of self-adjusting heat dissipation.
Description
technical field [0001] The invention relates to the technical field of light emitting diodes, in particular to a light emitting diode and a manufacturing method thereof. Background technique [0002] After the light-emitting diodes in the prior art are produced, the epoxy resin cap directly wraps the chip unit, and the lead rod is drawn out from the epoxy resin cap. This assembly method has the problem of poor heat dissipation, thereby reducing the service life of the entire light-emitting diode . [0003] If a light-emitting diode can be invented that has the effect of self-adjusting heat dissipation, has stable and powerful functions, and is convenient and quick to disassemble, the problem can be solved. Therefore, we provide a light-emitting diode and a manufacturing method thereof. Contents of the invention [0004] (1) Technical problems to be solved [0005] In order to solve the above-mentioned problems in the prior art, the present invention provides a light-emit...
Claims
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IPC IPC(8): H01L33/48H01L33/64
CPCH01L33/48H01L33/483H01L33/64H01L2933/0033
Inventor 李泳蔡瑞飞
Owner 南通宝恒工贸有限公司