Unlock instant, AI-driven research and patent intelligence for your innovation.

Transistor and method of making the same

A transistor and sidewall technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical solid-state devices, etc., can solve problems such as poor performance, poor device uniformity, and incompatibility between manufacturing processes and large-scale manufacturing

Active Publication Date: 2022-07-15
BEIJING HUA TAN YUAN XIN ELECTRONICS TECH CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The inventors have found that current transistors using carbon nanotubes as channel materials still have problems such as poor practical performance, incompatibility between manufacturing process and scale manufacturing, and poor device uniformity.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Transistor and method of making the same
  • Transistor and method of making the same
  • Transistor and method of making the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0058] The following describes in detail the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as a limitation of the present invention.

[0059] In one aspect of the present invention, the present invention provides a transistor. According to an embodiment of the present invention, refer to figure 1 , the transistor includes: a substrate 100, a low-dimensional material layer 200, a plurality of sidewall spacers 500, a source electrode 620, a drain electrode 630 and a gate structure 800. The low-dimensional material layer 200 is arranged above the substrate 100, and the sidewall spacers 500 are arranged on the lower...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a transistor and a manufacturing method. The transistor includes: a substrate and a low-dimensional material layer disposed above the substrate; a plurality of sidewall spacers, the sidewall spacers being disposed on a side of the low-dimensional material layer away from the substrate, and a plurality of the sidewalls The walls are spaced apart; a source electrode and a drain electrode, the source electrode and the drain electrode are arranged on the side of the low-dimensional material layer away from the substrate; a gate structure, the gate structure is arranged on the low-dimensional material layer a side of the material layer away from the substrate, the gate structure is located between the source electrode and the drain electrode, and the gate structure, the source electrode and the drain electrode are all separated by the spacers open, and the gate structure, the source electrode and the drain electrode are all in contact with the spacer. Therefore, the transistor has the advantages of excellent comprehensive performance, high process compatibility, and good device uniformity.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, and in particular, to a transistor and a manufacturing method. Background technique [0002] Carbon nanotubes are ideal transistor channel materials with excellent physical and chemical properties such as one-dimensional ultrathinness, high mobility, perfect lattice, high physical and chemical stability, and high thermal conductivity. Transistors using carbon nanotubes as channel materials have significant advantages over traditional transistors in extreme performance and energy utilization efficiency, and have low process costs and high process compatibility, making it easier to achieve three-dimensional integration. [0003] However, there is still room for improvement in transistors and fabrication methods using carbon nanotubes as channel materials. SUMMARY OF THE INVENTION [0004] The present invention is made based on the inventors' findings and understanding of the follo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L29/06H01L29/10H01L29/417H01L21/336H01L29/78
CPCH01L29/0657H01L29/0665H01L29/1033H01L29/41725H01L29/78H01L29/42356H01L29/6656H10K10/82H10K85/221H10K10/84H01L21/02301H01L21/30604H01L29/401H01L29/42368
Inventor 许海涛
Owner BEIJING HUA TAN YUAN XIN ELECTRONICS TECH CO LTD