Semiconductor testing equipment

Abstract

The invention relates to the technical field of semiconductor testing, in particular to semiconductor testing equipment which comprises an L-shaped bottom plate, the top surface of the L-shaped bottom plate is rotatably connected with a tray, the top surface of the tray is uniformly and rotatably connected with a plurality of first gears through a rotating shaft, and the top end of the rotating shaft is fixedly connected with a limiting mechanism. A dust collection mechanism is fixedly connected to the middle of the top face of the tray, a guide rail is fixedly connected to the bottom of the top plate, and a clamping plate fixedly connected with the bottom face of the top plate is slidably clamped into the guide rail. According to the invention, the air cylinder drives the clamping plate to move along the guide rail, the connecting column drives the probe equipment to move up and down to test wafers under the limiting action of the triangular groove in the clamping plate, the supporting plate rotates to replace different wafers for testing under the action of the first driving mechanism, and the wafers are limited and fixed under the action of the second driving mechanism. Wafer testing, wafer fixing, wafer replacing and wafer cleaning are achieved through one air cylinder, the structure is simple, and the working efficiency of wafer testing is improved.

Description

technical field

[0001] The invention relates to the technical field of semiconductor testing, in particular to semiconductor testing equipment. Background technique

[0002] Wafer testing is to use probes to test the crystal grains on the wafer. Before testing, the operator generally needs to align the probes on the electrical tester with the wafer, and fix the position of the wafer to prevent probes. When the needle touches the wafer, the probe and the surface of the wafer will slip, which will cause the wafer to deviate from the initial position and affect the test results of the wafer. Because the dust in the air is charged, when it falls on the surface of the wafer, it will Affects the heat dissipation of the wafer, resulting in thermal energy accumulation, resulting in inaccurate data when the probes test the resistivity and temperature of the wafer, which further affects the test results of the wafer. In addition, most test equipment can only be installed one at a time...

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