Panel frame sealing structure, display panel and manufacturing method of display panel

Pending Publication Date: 2021-11-23
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The embodiments of the present application provide a panel frame sealing structure, a display panel, and a manufacturing method of the display panel, which solve the problem of the array substrate and the color filter substrate caused by improving the adhesion between the array substrate and the color filter substrate in the prior art. The problem of poor support between the color filter substrates makes it easier to pass the PCT verification and the display results of the display panel are more accurate

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  • Panel frame sealing structure, display panel and manufacturing method of display panel
  • Panel frame sealing structure, display panel and manufacturing method of display panel
  • Panel frame sealing structure, display panel and manufacturing method of display panel

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Embodiment Construction

[0046]Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. It should be understood, however, that these descriptions are exemplary only, and are not intended to limit the scope of the present disclosure. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concepts of the present disclosure.

[0047] Various structural schematic diagrams according to embodiments of the present disclosure are shown in the accompanying drawings. The figures are not drawn to scale, with certain details exaggerated and possibly omitted for clarity of presentation. The shapes of the various regions and layers shown in the figure, as well as their relative sizes and positional relationships are only exemplary, and may deviate due to manufacturing tolerances or technical limitations in practice, and those skilled in the art will Regions / layers with different shapes, s...

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PUM

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Abstract

The invention discloses a panel frame sealing structure, a display panel and a manufacturing method of the display panel, and the substrate frame sealing structure comprises a first substrate, an organic film layer of the first substrate being provided with a plurality of grooves; a second substrate, arranged opposite to the first substrate, a plurality of supporting structures being formed on the side, close to the organic film layer, of the second substrate, and the supporting structures being all opposite to the grooves; and a frame sealing glue filled in the space between the second substrate and the first substrate, and the frame sealing glue at least covering the groove and the supporting structure. According to the substrate frame sealing structure, the problem that in the prior art, adhesion between a TFT substrate and a color film substrate is improved, and meanwhile supporting between the TFT substrate and the color film substrate is poor is solved, PCT verification is easier to pass, and the display result of a display panel is more accurate.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a panel frame sealing structure, a display panel and a manufacturing method of the display panel. Background technique [0002] At present, the high temperature cooking test (PCT, Pressure Cooker Test), as a commonly used test and evaluation method for liquid crystal screens, is mainly used to evaluate the reliability of liquid crystal screens in extreme environments. The experimental results can indicate the strength of the adhesion between the array substrate and the color filter substrate of the liquid crystal screen in an extreme environment; the array substrate is a TFT (Thin Film Transistor, thin film transistor) substrate. If there is an abnormality in the verification, it can be determined that there may be a problem with the adhesion of the sample, which needs further improvement. At present, in traditional display devices, the sealant is placed on the peripheral area ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/1339
CPCG02F1/1339G02F1/13394G02F1/13396
Inventor 栗鹏李哲李晓吉潘瑞琦孙志丹
Owner BOE TECH GRP CO LTD
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